LH1523BAC Vishay, LH1523BAC Datasheet - Page 2

• Manufacturer Part Number: LH1523BAC
• Description: IC,Normally-Closed PC-Mount Solid-State Relay,2-CHANNEL,SO
• Manufacturer: Vishay

Specifications of LH1523BAC

• Load Voltage Rating: 200 V
• Load Current Rating: 0.2 A
• Contact Form: 2 Form B
• Output Device: MOSFET
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Package / Case: PDIP-8
• Output Type: AC, DC
• Mounting Style: SMD/SMT
• Case Color: Black
• Relay Type: Solid State
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

LH1523BB, LH1523BAC, LH1523BACTR
Vishay Semiconductors
Notes
• Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
(1)
(2)
Note
• Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering
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2
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
ABSOLUTE MAXIMUM RATINGS (T
PARAMETER
INPUT
LED continuous forward current
LED reverse voltage
OUTPUT
DC or peak AC load voltage
Continuous DC load current,
one pole operating
Continuous DC load current,
two poles operating
Peak load current (single shot)
SSR
Ambient temperature range
Storage temperature range
Pin soldering temperature
Input to output isolation voltage
Pole-to-pole isolation voltage (S1 to S2)
(dry air, dust free, at sea level)
Output power dissipation (continuous)
ELECTRICAL CHARACTERISTICS (T
PARAMETER
INPUT
LED forward current, switch turn-on
LED forward current, switch turn-off
LED forward voltage
OUTPUT
On-resistance
Off-resistance
Off-state leakage current
Output capacitance
TRANSFER
Capacitance (input to output)
SWITCHING CHARACTERISTICS (T
PARAMETER
Turn-on time
Turn-off time
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
Breakdown occurs between the output pins external to the package.
Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through
hole devices (DIP).
evaluations. Typical values are for information only and are not part of the testing requirements.
(2)
For technical questions, contact:
(1)
,
Dual 1 Form B Solid State Relay
This datasheet is subject to change without notice.
t = 1 s, I
amb
amb
I
amb
L
I
I
TEST CONDITION
I
I
F
F
I
F
F
= ± 200 mA, t = 10 ms
F
I
TEST CONDITION
TEST CONDITION
= 5 mA, V
= 5 mA, V
F
= 10 mA, I
= 10 mA, I
= 25 °C, unless otherwise specified)
= 25 °C, unless otherwise specified)
t = 10 s max.
= 0 mA, I
= 5 mA, V
t = 100 ms
= 25 °C, unless otherwise specified)
I
I
R
L
V
ISO
I
L
V
 50 μA
F
 10 μA
ISO
= ± 150 V
= 10 mA
= 10 μA max.
= 1 V
L
L
L
L
L
= ± 100 V
= ± 200 V
L
= 50 mA
= 50 mA
= 50 mA
= 50 V
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SYMBOL
SYMBOL
SYMBOL
R
R
I
I
C
T
P
C
V
t
t
Fon
Foff
V
T
T
I
on
off
V
V
ON
Off
O
amb
I
diss
IO
I
I
I
ISO
F
O
stg
sld
F
L
L
P
R
L
MIN.
MIN.
1.15
0.2
0.1
- 40 to + 125
- 40 to + 85
VALUE
3750
1600
200
200
140
400
260
600
50
5
TYP.
TYP.
1.22
0.07
0.9
1.4
10
50
1
3
1
2
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Document Number: 83822
MAX.
MAX.
Rev. 1.5, 10-Mar-11
1.45
15
2
1
3
3
UNIT
V
mW
mA
mA
mA
mA
°C
°C
°C
RMS
V
V
V
UNIT
UNIT
G
mA
mA
μA
ms
ms
pF
pF

V