PIC18LF25J10-I/SP Microchip Technology, PIC18LF25J10-I/SP Datasheet - Page 7
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PIC18LF25J10-I/SP
Manufacturer Part Number
PIC18LF25J10-I/SP
Description
Microcontroller
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F24J10-ISO.pdf
(368 pages)
2.PIC18F24J10-ISO.pdf
(6 pages)
3.PIC18F24J10-ISO.pdf
(6 pages)
4.PIC18F24J10-ISO.pdf
(12 pages)
5.PIC18LF24J10-ISS.pdf
(32 pages)
Specifications of PIC18LF25J10-I/SP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SPIC, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183022, DM183032, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162074 - HEADER INTRFC MPLAB ICD2 44TQFPMA180012 - MODULE PLUG-IN 18LF25J10 28SOICAC162067 - HEADER INTRFC MPLAB ICD2 40/28PAC164329 - MODULE SKT FOR 40DIP 18F45J10
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18LF25J10-I/SP
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
PIC18LF25J10-I/SP
Manufacturer:
MICROCHIP
Quantity:
12 000
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ..................................................................................................................................................................................... 97
11.0 Timer0 Module ......................................................................................................................................................................... 115
12.0 Timer1 Module ......................................................................................................................................................................... 119
13.0 Timer2 Module ......................................................................................................................................................................... 125
14.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 127
15.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 135
16.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 149
17.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 193
18.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 215
19.0 Comparator Module.................................................................................................................................................................. 225
20.0 Comparator Voltage Reference Module................................................................................................................................... 231
21.0 Special Features of the CPU.................................................................................................................................................... 235
22.0 Instruction Set Summary .......................................................................................................................................................... 249
23.0 Development Support............................................................................................................................................................... 299
24.0 Electrical Characteristics .......................................................................................................................................................... 303
25.0 Packaging Information.............................................................................................................................................................. 337
Appendix A: Revision History............................................................................................................................................................. 349
Appendix B: Migration Between High-End Device Families............................................................................................................... 350
Index .................................................................................................................................................................................................. 353
The Microchip Web Site ..................................................................................................................................................................... 363
Customer Change Notification Service .............................................................................................................................................. 363
Customer Support .............................................................................................................................................................................. 363
Reader Response .............................................................................................................................................................................. 364
PIC18F45J10 family Product Identification System ........................................................................................................................... 365
© 2009 Microchip Technology Inc.
Device Overview .......................................................................................................................................................................... 7
Guidelines for Getting Started with PIC18FJ Microcontrollers ................................................................................................... 23
Oscillator Configurations ............................................................................................................................................................ 27
Power-Managed Modes ............................................................................................................................................................. 35
Reset .......................................................................................................................................................................................... 41
Memory Organization ................................................................................................................................................................. 51
Flash Program Memory.............................................................................................................................................................. 71
8 x 8 Hardware Multiplier............................................................................................................................................................ 81
Interrupts .................................................................................................................................................................................... 83
PIC18F45J10 FAMILY
DS39682E-page 5