PIC18LF24J10-I/SP Microchip Technology, PIC18LF24J10-I/SP Datasheet - Page 17
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PIC18LF24J10-I/SP
Manufacturer Part Number
PIC18LF24J10-I/SP
Description
Microcontroller
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F24J10-ISO.pdf
(368 pages)
3.PIC18F24J10-ISO.pdf
(6 pages)
4.PIC18F24J10-ISO.pdf
(6 pages)
5.PIC18F24J10-ISO.pdf
(12 pages)
6.PIC18LF24J10-ISS.pdf
(32 pages)
Specifications of PIC18LF24J10-I/SP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
16KB (8K x 16)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SPIC, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183032, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162074 - HEADER INTRFC MPLAB ICD2 44TQFPMA180012 - MODULE PLUG-IN 18LF25J10 28SOICAC162067 - HEADER INTRFC MPLAB ICD2 40/28PAC164329 - MODULE SKT FOR 40DIP 18F45J10
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18LF24J10-I/SP
Manufacturer:
Microchip Technology
Quantity:
135
4.2
The verify step involves reading back the code memory
space and comparing it against the copy held in the
programmer’s buffer. Because the Flash Configuration
Words are stored at the end of program memory, it is
verified with the rest of the code at this time.
The verify process is shown in the flowchart in
Figure 4-2. Memory reads occur a single byte at a time,
so two bytes must be read to compare against the word
in the programmer’s buffer. Refer to Section 4.1
“Read Code Memory” for implementation details of
reading code memory.
FIGURE 4-2:
© 2009 Microchip Technology Inc.
Note:
Verify Code Memory and
Configuration Word
No
Because the Flash Configuration Word
contains the device code protection bit,
code memory should be verified immedi-
ately after writing if code protection is
enabled. This is because the device will not
be readable or verifiable if a device Reset
occurs after the Flash Configuration Words
(and the CP0 bit) have been cleared.
with Post-Increment
with Post-Increment
Set TBLPTR = 0
Read High Byte
Read Low Byte
Word = Expect
Code Memory
Verified?
Data?
Does
Done
Start
VERIFY CODE
MEMORY FLOW
All
Yes
Yes
No
PIC18F2XJXX/4XJXX FAMILY
Failure,
Report
Error
4.3
The term “Blank Check” means to verify that the device
has no programmed memory cells. All memories must
be verified: code memory and Configuration bits. The
Device ID registers (3FFFFEh:3FFFFFh) should be
ignored.
A “blank” or “erased” memory cell will read as a ‘1’, so
Blank Checking a device merely means to verify that all
bytes read as FFh. The overall process flow is shown
in Figure 4-3.
Given that Blank Checking is merely code verification
with FFh expect data, refer to Section 4.2 “Verify Code
Memory and Configuration Word” for implementation
details.
FIGURE 4-3:
Blank Check Device
Blank Check
Device
Blank?
Abort
Start
Is
No
BLANK CHECK FLOW
Yes
Continue
DS39687E-page 17