PIC10F222T-E/OT Microchip Technology, PIC10F222T-E/OT Datasheet - Page 78

• Manufacturer Part Number: PIC10F222T-E/OT
• Description: Microcontroller
• Manufacturer: Microchip Technology
• Series: PIC® 10Fr

Specifications of PIC10F222T-E/OT

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 8MHz
• Peripherals: POR, WDT
• Number Of I /o: 3
• Program Memory Size: 768B (512 x 12)
• Program Memory Type: FLASH
• Ram Size: 23 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: SOT-23-6
• Processor Series: PIC10F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 23 B
• Interface Type: USB
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 4
• Number Of Timers: 1
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 2 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162070 - HEADER INTRFC MPLAB ICD2 8/14PXLT06SOT - SOCKET TRAN ICE 6SOT W/CABLEAC163020 - ADAPTER PROGRAMMER PIC10F2XXAC164321 - MODULE SKT 6L PM3 SOT23AC164037 - MODULE SKT 6L PROMATE II SOT23
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC10F220/222
DS41270E-page 76
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
e
Units
L
A2
A1
E1
eB
E1
b1
N
D
A
E
e
L
c
b
A2
.115
.015
.290
.240
.348
.115
.008
.040
.014
MIN
–
–
eB
.100 BSC
E
INCHES
NOM
.365
.060
.018
.130
.310
.250
.130
.010
8
–
–
–
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–