PIC10F202T-E/OT Microchip Technology, PIC10F202T-E/OT Datasheet - Page 87
![IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,TSOP,6PIN,PLASTIC](/photos/6/59/65928/sot-23-6_pkg_sml.jpg)
PIC10F202T-E/OT
Manufacturer Part Number
PIC10F202T-E/OT
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,TSOP,6PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 10Fr
Datasheets
1.PIC10F200T-IOT.pdf
(96 pages)
2.PIC10F200T-IOT.pdf
(6 pages)
3.PIC10F200T-IOT.pdf
(18 pages)
Specifications of PIC10F202T-E/OT
Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
3
Program Memory Size
768B (512 x 12)
Program Memory Type
FLASH
Ram Size
24 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
SOT-23-6
Processor Series
PIC10F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
24 B
Interface Type
USB
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
4
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162059 - HEADER INTRFC MPLAB ICD2 8/14PINXLT06SOT - SOCKET TRAN ICE 6SOT W/CABLEAC163020 - ADAPTER PROGRAMMER PIC10F2XXAC164321 - MODULE SKT 6L PM3 SOT23AC164037 - MODULE SKT 6L PROMATE II SOT23
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC10F202T-E/OT
Manufacturer:
XILINX
Quantity:
101
© 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
NOTE 1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
E
A
NOTE 2
EXPOSED PAD
Units
PIC10F200/202/204/206
A1
A3
D2
E2
N
A
D
E
K
e
b
L
L
K
0.80
0.00
1.30
1.50
0.18
0.30
0.20
MIN
MILLIMETERS
b
BOTTOM VIEW
0.50 BSC
2.00 BSC
3.00 BSC
0.20 REF
NOM
0.90
0.02
0.25
0.40
8
–
–
–
Microchip Technology Drawing C04-123B
D2
2
e
1
N
MAX
1.00
0.05
1.75
1.90
0.30
0.50
–
E2
NOTE 1
DS41239D-page 85