MCP3301-BI/MS Microchip Technology, MCP3301-BI/MS Datasheet - Page 24
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MCP3301-BI/MS
Manufacturer Part Number
MCP3301-BI/MS
Description
IC,A/D CONVERTER,SINGLE,13-BIT,TSSOP,8PIN
Manufacturer
Microchip Technology
Datasheet
1.MCP3301-CIMS.pdf
(32 pages)
Specifications of MCP3301-BI/MS
Rohs Compliant
YES
Number Of Bits
13
Sampling Rate (per Second)
100k
Data Interface
Serial, SPI™
Number Of Converters
1
Voltage Supply Source
Single Supply
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
TMPSNS-RTD1 - BOARD EVAL PT100 RTD TEMP SENSOR
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MCP3301BI/MS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP3301-BI/MS
Manufacturer:
Microchip
Quantity:
4 000
MCP3301
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS21700C-page 24
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
1
N
b
2
D
e
E1
A2
Dimension Limits
E
c
Units
A2
A1
E1
L1
N
A
E
D
e
L
φ
c
b
0.75
0.00
0.40
0.08
0.22
MIN
0°
–
L1
MILLIMETERS
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
0.60
0.85
8
–
–
–
–
–
Microchip Technology Drawing C04-111B
© 2007 Microchip Technology Inc.
MAX
1.10
0.95
0.15
0.80
0.23
0.40
8°
L
φ