MCP1404-E/MF Microchip Technology, MCP1404-E/MF Datasheet

MCP1404-E/MF

Manufacturer Part Number

MCP1404-E/MF

Description

IC,Dual MOSFET Driver,CMOS,LLCC,8PIN,PLASTIC

Manufacturer

Microchip Technology

Type

Low Sider

Datasheet

1.MCP1404-EP.pdf (22 pages)

Specifications of MCP1404-E/MF

Configuration

Low-Side

Input Type

Non-Inverting

Delay Time

40ns

Current - Peak

4.5A

Number Of Configurations

Number Of Outputs

Voltage - Supply

4.5 V ~ 18 V

Operating Temperature

-40°C ~ 125°C

Mounting Type

Surface Mount

Package / Case

8-DFN

Rise Time

28 ns

Fall Time

28 ns

Supply Voltage (min)

4.5 V

Supply Current

2 mA

Maximum Operating Temperature

+ 125 C

Mounting Style

SMD/SMT

Minimum Operating Temperature

- 40 C

Number Of Drivers

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

High Side Voltage - Max (bootstrap)

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

Current page: 1 of 22
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Features

• High Peak Output Current: 4.5A (typ.)

• Low Shoot-Through/Cross-Conduction Current in

• Wide Input Supply Voltage Operating Range:

• High Capacitive Load Drive Capability:

• Short Delay Times: 40 ns (typ.)

• Low Supply Current:

• Latch-Up Protected: Will Withstand 1.5A Reverse

• Logic Input Will Withstand Negative Swing

• Packages: 8-Pin SOIC, PDIP, 8-Pin 6x5 DFN,

Applications

• Switch Mode Power Supplies

• Pulse Transformer Drive

• Line Drivers

• Motor and Solenoid Drive

Package Types

GND

Output Stage

- 4.5V to 18V

- 2200 pF in 15 ns

- 5600 pF in 34 ns

- With Logic ‘1’ Input – 1.0 mA (typ.)

- With Logic ‘0’ Input – 150 µA (typ.)

Current

Up To 5V

and 16-Pin SOIC

GND

IN A

IN B

IN A

IN B

PDIP/SOIC

8-Pin DFN

8-Pin

4.5A Dual High-Speed Power MOSFET Drivers

(2)

MCP1403

OUT A

OUT B

MCP1403

OUT A

OUT B

MCP1404

OUT A

OUT B

MCP1404

OUT A

OUT B

MCP1405

OUT A

OUT B

MCP1405

OUT A

OUT B

Note 1: Duplicate pins must both be connected for

GND

IN A

IN B

MCP1403/4/5

General Description

The MCP1403/4/5 are a family of dual-inverting, dual-

non-inverting, or complimentary output drivers. They

can delivery high peak currents of 4.5A typically into

capacitive loads. These devices also feature low shoot-

through

propagation delays.

The MCP1403/4/5 drivers operate from a 4.5V to 18V

single power supply and can easily charge and

discharge 2200 pF gate capacitance in under 15 ns

(typ). They provide low enough impedances in both the

on and off states to ensure the MOSFETs intended

state will not be affected, even by large transients. The

input to the MCP1403/4/5 may be driven directly from

either TTL or CMOS (3V to 18V).

The MCP1403/4/5 dual-output 4.5A driver family is

offered in both surface-mount and pin-through-hole

packages with a -40

The low thermal resistance of the thermally enhanced

DFN package allows for greater power dissipation

capability for driving heavier capacitive or resistive

loads.

These devices are highly latch-up resistant under any

conditions within their power and voltage ratings. They

are not subject to damage when up to 5V of noise

spiking (of either polarity) occurs on the ground pin. All

terminals are fully protect against Electrostatic

Discharge (ESD) up to 4 kV.

2: Exposed pad of the DFN package is electrically

16-Pin SOIC

proper operation.

isolated.

current,

matched

C to +125

MCP1403

OUT A

OUT B

MCP1404

rise/fall

C temperature rating.

OUT A

OUT B

DS22022B-page 1

MCP1405

times

OUT A

OUT B

and

Related parts for MCP1404-E/MF

MCP1404-E/MF Summary of contents

Page 1

... GND 4 OUT B GND MCP1405 Note 1: Duplicate pins must both be connected for proper operation. OUT A 2: Exposed pad of the DFN package is electrically isolated. OUT B matched rise/fall times and +125 C temperature rating. MCP1404 MCP1403 MCP1405 OUT A OUT A OUT A 15 OUT A OUT A OUT OUT B ...

Page 2

... MCP1403/4/5 (1) Functional Block Diagram Input Effective Input (Each Input) GND Note 1: Unused inputs should be grounded. DS22022B-page 2 Inverting 730 µA 300 mV Non-inverting 4.7V MCP1403 Dual Inverting MCP1404 Dual Non-inverting MCP1405 Inverting / Non-inverting V DD Output © 2007 Microchip Technology Inc. ...

Page 3

... Note 1: Switching times ensured by design. 2: Tested during characterization, not production tested. © 2007 Microchip Technology Inc. † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended ...

Page 4

... L Figure 4-1, Figure 4-2 Figure 4-1, Figure 4 (Both Inputs (Both Inputs) IN ≤ 18V. DD Units Conditions °C °C °C °C/W Typical four-layer board with vias to ground plane °C/W °C/W °C/W 4-Layer JC51-7 Standard Board, Natural Convection © 2007 Microchip Technology Inc. ...

Page 5

... Capacitive Load (pF) FIGURE 2-2: Rise Time vs. Capacitive Load 1800 pF LOAD FALL RISE 12 -40 -25 - 110 125 o Temperature ( C) FIGURE 2-3: Rise and Fall Times vs. Temperature. © 2007 Microchip Technology Inc. ≤ 18V. DD 100 2200 FIGURE 2-4: Voltage. 100 12V 1000 10000 FIGURE 2-5: Load ...

Page 6

... FIGURE 2-10: Temperature FIGURE 2-11: High) vs. Supply Voltage + Both Inputs = FIGURE 2-12: Low) vs. Temperature. Both Inputs = 110 125 o Temperature ( C) Quiescent Current vs (MCP1404 (MCP1403 +150 + Supply Voltage (V) Output Resistance (Output (MCP1404 (MCP1403 +150 Supply Voltage (V) Output Resistance (Output © 2007 Microchip Technology Inc. ...

Page 7

... Capacitive Load (pF) FIGURE 2-14: Supply Current vs. Capacitive Load. 120 3.5 MHz DD 100 80 200 kHz 60 500 kHz 100 1000 Capacitive Load (pF) FIGURE 2-15: Supply Current vs. Capacitive Load. © 2007 Microchip Technology Inc. ≤ 18V 18V 10000 FIGURE 2-16: Frequency. 140 V = 12V DD 120 ...

Page 8

... For a sin- gle driver, divide the stated value by 2. For a single transition of a single driver divide the stated value by 4. FIGURE 2-19: Crossover Energy vs. Supply Voltage. DS22022B-page 8 ≤ 18V © 2007 Microchip Technology Inc. ...

Page 9

... Ground is the device return pin. The ground pin should have a low impedance connection to the bias supply source return. High peak currents will flow out the ground pin when the capacitive load is being discharged. © 2007 Microchip Technology Inc. Table 3-1. (1) Description ...

Page 10

... PCB trace loop area and inductance should be minimized by the use of ground planes or trace under MOSFET gate drive signals, separate analog and power grounds, and local driver decoupling 18V DD 0.1 µF 1 µF Ceramic Output C = 2200 pF L MCP1404 (1/2 MCP1405) 90% 90% 90 10% 10% Non-Inverting Driver Timing and GND. A 1.0 µ ...

Page 11

... C = Total load capacitance MOSFET driver supply voltage DD © 2007 Microchip Technology Inc. 4.5.2 QUIESCENT POWER DISSIPATION The power dissipation associated with the quiescent current draw depends upon the state of the input pin. The MCP1403/4/5 devices have a quiescent current draw when both inputs are high of 1.0 mA (typ) and ...

Page 12

Page 13

... Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. © 2007 Microchip Technology Inc ...

Page 14

... E1 .240 D .348 L .115 c .008 b1 .040 b .014 eB – c NOM MAX 8 – .210 .130 .195 – – .310 .325 .250 .280 .365 .400 .130 .150 .010 .015 .060 .070 .018 .022 – .430 Microchip Technology Drawing C04-018B © 2007 Microchip Technology Inc. ...

Page 15

... Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. © 2007 Microchip Technology Inc ...

Page 16

Page 17

... Page 14: Updated Package Outline Drawing • Page 15: Updated Package Outline Drawing • Page 16: Updated Package Outline Drawing • Page 17: Updated Revision History • Page 19: Corrected Package Codes in Product Identification System Revision A (December 2006) • Original Release of this Document. © 2007 Microchip Technology Inc. MCP1403/4/5 DS22022B-page 17 ...

Page 18

Page 19

... Dual MOSFET Driver, Inverting MCP1403T: 4.5A Dual MOSFET Driver, Inverting (Tape and Reel) MCP1404: 4.5A Dual MOSFET Driver, Non-Inverting MCP1404T: 4.5A Dual MOSFET Driver, Non-Inverting (Tape and Reel) MCP1405: 4.5A Dual MOSFET Driver, Complementary MCP1405T: 4.5A Dual MOSFET Driver, Complementary ...

Page 20

Page 21

... PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...

Page 22

... Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2007 Microchip Technology Inc. EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 ...

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