LM60CIM3X National Semiconductor, LM60CIM3X Datasheet - Page 6

• Manufacturer Part Number: LM60CIM3X
• Description: IC,TEMPERATURE SENSOR,BIPOLAR,TO-236,3PIN,PLASTIC
• Manufacturer: National Semiconductor

Specifications of LM60CIM3X

• Rohs Compliant: NO

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Typical Performance Characteristics
circuit board as shown in Figure 2. (Continued)
1.0 Mounting
The LM60 can be applied easily in the same way as other
integrated-circuit temperature sensors. It can be glued or
cemented to a surface. The temperature that the LM60 is
sensing will be within about +0.1˚C of the surface tempera-
ture that LM60’s leads are attached to.
This presumes that the ambient air temperature is almost the
same as the surface temperature; if the air temperature were
much higher or lower than the surface temperature, the
actual temperature of the LM60 die would be at an interme-
diate temperature between the surface temperature and the
air temperature.
To ensure good thermal conductivity the backside of the
LM60 die is directly attached to the GND pin. The lands and
traces to the LM60 will, of course, be part of the printed
circuit board, which is the object whose temperature is being
measured. These printed circuit board lands and traces will
not cause the LM60’s temperature to deviate from the de-
sired temperature.
Alternatively, the LM60 can be mounted inside a sealed-end
metal tube, and can then be dipped into a bath or screwed
FIGURE 2. Printed Circuit Board Used
for Heat Sink to Generate All Curves.
with 2 oz. Copper Foil or Similar.
1
⁄
2
" Square Printed Circuit Board
To generate these curves the LM60 was mounted to a printed
6
into a threaded hole in a tank. As with any IC, the LM60 and
accompanying wiring and circuits must be kept insulated and
dry, to avoid leakage and corrosion. This is especially true if
the circuit may operate at cold temperatures where conden-
sation can occur. Printed-circuit coatings and varnishes such
as Humiseal and epoxy paints or dips are often used to
ensure that moisture cannot corrode the LM60 or its connec-
tions.
The thermal resistance junction to ambient (θ
parameter used to calculate the rise of a device junction
temperature due to the device power dissipation. For the
LM60 the equation used to calculate the rise in the die
temperature is as follows:
where I
the output.
The table shown in Figure 3 summarizes the rise in die
temperature of the LM60 without any loading, and the ther-
mal resistance for different conditions.
T
J
Q
= T
is the quiescent current and I
A
01268114
+ θ
JA
[(+V
S
I
Q
) + (+V
S
− V
L
is the load current on
O
) I
L
]
JA
) is the