LM2623LD National Semiconductor, LM2623LD Datasheet - Page 5

• Manufacturer Part Number: LM2623LD
• Description: IC,SMPS CONTROLLER,VOLTAGE-MODE,BICMOS,LLCC,14PIN,PLASTIC
• Manufacturer: National Semiconductor

Specifications of LM2623LD

• Rohs Compliant: NO

Electrical Characteristics
(Continued)
Note 8: Junction to ambient thermal resistance (θ
) is taken from a thermal modeling result, performed under the conditions and guidelines set forthe in the JEDEC
JA
standard JESD51-17. The test board is a 4 layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 3 x 2 array of thermal vias. The ground plane on the board
is 50mm x 50 mm. Thickness of copper layers are 36mm/18mm/18mm/36mm (1.5oz/10z/1oz/1.5ox). Ambient temperature in simulation is 22˚C, still air. Power
dissipation is 1W. (The DAP is soldered.) Fore more information on LLP thermal topics, as well as LLP mounting and soldering specifications please refer to
Application Note 1187: Leadless Leadframe Package (LLP).
Note 9: Exposed DAP soldered to an exposed 1sq. inch area of 1 oz. copper. Thermal resistance can be decreased by using more copper are to dissipate heat.
5
www.national.com