DSPIC30F6013A-20E/PT Microchip Technology, DSPIC30F6013A-20E/PT Datasheet - Page 233
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DSPIC30F6013A-20E/PT
Manufacturer Part Number
DSPIC30F6013A-20E/PT
Description
Digital Signal Processor
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F6011A-30IPT.pdf
(234 pages)
4.DSPIC30F6011A-30IPT.pdf
(8 pages)
5.DSPIC30F6011A-30IPT.pdf
(10 pages)
6.DSPIC30F6011A-30IPT.pdf
(6 pages)
7.DSPIC30F6011A-30IPT.pdf
(8 pages)
8.DSPIC30F6011A-30IPT.pdf
(16 pages)
Specifications of DSPIC30F6013A-20E/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
132KB (44K x 24)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
80-TFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300024 - KIT DEMO DSPICDEM 1.1XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC30F007 - MODULE SKT FOR DSPIC30F 80TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6013A-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6013A-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F2011-20IP PDF datasheet #2
- DSPIC30F6011A-30IPT PDF datasheet #3
- DSPIC30F6011A-30IPT PDF datasheet #4
- DSPIC30F6011A-30IPT PDF datasheet #5
- DSPIC30F6011A-30IPT PDF datasheet #6
- DSPIC30F6011A-30IPT PDF datasheet #7
- DSPIC30F6011A-30IPT PDF datasheet #8
- Current page: 233 of 234
- Download datasheet (4Mb)
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2011 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F6011AT-30I/PF = 30 MIPS, Industrial temp., TQFP (14x14) package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
dsPIC30F6011A/6012A/6013A/6014A
d s P I C 3 0 F 6 0 11 AT- 3 0 I / P F - E S
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Package
S
W
PT = 10x10 (64 TQFP )
PF = 14x14 (64 TQFP )
PT = 12x12 (80 TQFP )
PF = 14x14 (80 TQFP)
A,B,C… = Revision Level
Custom ID (3 digits) or
Engineering Sample (ES)
= Die (Waffle Pack)
= Die (Wafers)
T = Tape and Reel
DS70143E-page 233
Speed
30 = 30 MIPS
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