DSPIC30F2020T-30I/SO Microchip Technology, DSPIC30F2020T-30I/SO Datasheet - Page 285
DSPIC30F2020T-30I/SO
Manufacturer Part Number
DSPIC30F2020T-30I/SO
Description
12KB, Flash, 512bytes-RAM, 30MIPS, 21I/O, 16-bit Family,nanoWatt 28 SOIC .300in
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.AC164335.pdf
(286 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F1010-30ISO.pdf
(26 pages)
4.DSPIC30F1010-30ISO.pdf
(50 pages)
Specifications of DSPIC30F2020T-30I/SO
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300023 - KIT DEMO DSPICDEM SMPS BUCKDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F2020T-30I/SOTR
- AC164335 PDF datasheet
- DSPIC30F2011-20IP PDF datasheet #2
- DSPIC30F1010-30ISO PDF datasheet #3
- DSPIC30F1010-30ISO PDF datasheet #4
- Current page: 285 of 286
- Download datasheet (5Mb)
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2006 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F2020AT-30I/SO = 30 MIPS, Industrial temp., SOIC package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
d s P I C 3 0 F 2 0 2 0 AT - 3 0 I / S O - E S
Preliminary
dsPIC30F1010/202X
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Custom ID (3 digits) or
Engineering Sample (ES)
Package
MM = QFN
PT = TQFP
SP = SPDIP
SO = SOIC
S
W
A,B,C… = Revision Level
= Die (Waffle Pack)
= Die (Wafers)
T = Tape and Reel
DS70178C-page 283
Speed
20 = 20 MIPS
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