DS9638CM National Semiconductor, DS9638CM Datasheet - Page 2
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DS9638CM
Manufacturer Part Number
DS9638CM
Description
RS422 Line Driver IC
Manufacturer
National Semiconductor
Specifications of DS9638CM
Device Type
Differential Line
No. Of Drivers
2
Driver Case Style
SOIC
No. Of Pins
8
Operating Temperature Range
0°C To +70°C
Termination Type
SMD
Propagation Delay
10ns
Supply Voltage Min
4.75V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DS9638CM
Manufacturer:
NS/国半
Quantity:
20 000
Part Number:
DS9638CMX
Manufacturer:
NS/国半
Quantity:
20 000
Company:
Part Number:
DS9638CMX/NOPB
Manufacturer:
NS
Quantity:
6 220
www.national.com
V
V
V
V
V
I
I
I
I
V
V
V
V
I
I
I
IH
IL
OS
X
CC
Over recommended operating temperature and supply voltage ranges, unless otherwise specified
Electrical Characteristics
Symbol
IH
IL
IC
OH
OL
T
T
OS
OS
Note 2: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The tables of “Electrical Characteristics provide conditions for actual device operation.
Note 3: Unless otherwise specified min/max limits apply across the −55˚C to +125˚C temperature range for the DS9638M and across the 0˚C to +70˚C range for
the DS9638C. All typicals are given for V
Note 4: All currents into the device pins are positive; all currents out of the device pins are negative. All voltages are referenced to ground unless otherwise specified.
Note 5: Only one output at a time should be shorted.
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Storage Temperature Range
Lead Temperature
Recommended Operating Conditions
Note 1: Derate cavity package 8.7 mW/˚C above 25˚C; derate molded DIP package 7.5 mW/˚C above 25˚C; derate SO package 6.5 mW˚C above 25˚C.
, V
–V
Ceramic DIP
Molded DIP and SO-8
, V
–V
T
T
OS
OS
Input Voltage HIGH
Input Voltage LOW
Input Clamp Voltage
Output Voltage HIGH
Output Voltage LOW
Input Current at Maximum
Input Voltage
Input Current HIGH
Input Current LOW
Output Short Circuit Current
Terminated Output Voltage
Output Balance
Output Offset Voltage
Output Offset Balance
Output Leakage Current
Supply Current
(Both Drivers)
Supply Voltage (V
Output Current HIGH (I
Output Current LOW (I
Operating Temperature (T
Parameter
CC
= 5V and T
CC
)
OL
OH
(Notes 3, 4)
−65˚C to +175˚C
−65˚C to +150˚C
)
A
)
A
= 25˚C.
)
(Note 2)
0˚C to +70˚C
−55˚C to +125˚C
V
V
V
V
V
V
V
V
V
V
See Figure 1
T
−0.25V
V
All input at 0V,
No Load
CC
IH
IL
CC
A
CC
CC
IL
CC
CC
CC
CC
Min
−55
4.5
= V
= V
= 25˚C
= V
= Min,
= 5.5V,
= Min, V
= Max, V
= Max, V
= Max, V
= Min, I
= Max, V
DS9638M
IL Max
IH Min
IL Max
<
Typ
5.0
V
25
X
,
Conditions
2
I
, I
<
IH
= −18 mA
I Max
IH
IL
O
OL
5.5V
= V
= 0V (Note 4)
= 0.5V
= 2.7V
V
Input Voltage
Max
Maximum Power Dissipation (Note 1) at 25˚C
−50
125
5.5
50
= 40 mA
CC
Ceramic DIP (Soldering, 60 sec.)
Molded DIP (Soldering, 10 sec.)
Cavity Package
Molded Package
SO Package
= 5.5V
IH Min
Lead Potential to Ground
I
I
OH
OH
,
4.75
= −10 mA
= −40 mA
Min
40
0
DS9638C
Typ
5.0
25
Min
−50
2.0
2.5
2.0
2.0
Max
5.25
−50
50
70
−1.0
Typ
3.5
Units
45
mA
mA
˚C
V
−200
−150
Max
−1.2
100
0.8
0.5
0.5
0.4
3.0
0.4
50
25
65
−0.5V to +7V
−5V to 7V
1300 mW
930 mW
810 mW
300˚C
265˚C
Units
mA
mA
µA
µA
µA
µA
V
V
V
V
V
V
V
V
V