AD9764ARZ Analog Devices Inc, AD9764ARZ Datasheet - Page 15

• Manufacturer Part Number: AD9764ARZ
• Description: IC,D/A CONVERTER,SINGLE,14-BIT,CMOS,SOP,28PIN
• Manufacturer: Analog Devices Inc
• Series: TxDAC®r

Specifications of AD9764ARZ

• Rohs Compliant: YES
• Settling Time: 35ns
• Number Of Bits: 14
• Number Of Converters: 1
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 170mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9764-EB - BOARD EVAL FOR AD9764
• Data Interface: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

I
ance range is adhered to. One additional consideration in this
mode is the integral nonlinearity (INL) as discussed in the Ana-
log Output section of this data sheet. For optimum INL perfor-
mance, the single-ended, buffered voltage output configuration
is suggested.
SINGLE-ENDED BUFFERED VOLTAGE OUTPUT
CONFIGURATION
Figure 37 shows a buffered single-ended output configuration in
which the op amp U1 performs an I-V conversion on the
AD9764 output current. U1 maintains I
virtual ground, thus minimizing the nonlinear output impedance
effect on the DAC’s INL performance as discussed in the Ana-
log Output section. Although this single-ended configuration
typically provides the best dc linearity performance, its ac distor-
tion performance at higher DAC update rates may be limited by
U1’s slewing capabilities. U1 provides a negative unipolar
output voltage and its full-scale output voltage is simply the
product of R
within U1’s voltage output swing capabilities by scaling I
and/or R
result with a reduced I
required to sink will be subsequently reduced.
POWER AND GROUNDING CONSIDERATIONS
In systems seeking to simultaneously achieve high speed and
high performance, the implementation and construction of the
printed circuit board design is often as important as the circuit
design. Proper RF techniques must be used in device selection,
placement and routing and supply bypassing and grounding.
Figures 42–47 illustrate the recommended printed circuit board
ground, power and signal plane layouts that are implemented on
the AD9764 evaluation board.
Proper grounding and decoupling should be a primary objective
in any high speed, high resolution system. The AD9764 features
separate analog and digital supply and ground pins to optimize
the management of analog and digital ground currents in a
REV. B
OUTFS
AD9764
Figure 36. 0 V to +0.5 V Unbuffered Voltage Output
and R
I
I
Figure 37. Unipolar Buffered Voltage Output
OUTA
OUTB 21
FB
AD9764
. An improvement in ac distortion performance may
22
I
I
FB
LOAD
OUTA
OUTB 21
and I
I
22
OUTFS
can be selected as long as the positive compli-
I
OUTFS
OUTFS
OUTFS
= 10mA
= 20mA
25
200
. The full-scale output should be set
since the signal current U1 will be
50
C
200
U1
R
OPT
FB
OUTA
V
OUTA
(or I
V
50
OUT
= 0 TO +0.5V
OUTB
= I
OUTFS
) at a
OUTFS
R
FB
–15–
system. In general, AVDD, the analog supply, should be decoupled
to ACOM, the analog common, as close to the chip as physi-
cally possible. Similarly, DVDD, the digital supply, should be
decoupled to DCOM as close as physically as possible.
For those applications requiring a single +5 V or +3 V supply
for both the analog and digital supply, a clean analog supply
may be generated using the circuit shown in Figure 38. The
circuit consists of a differential LC filter with separate power
supply and return lines. Lower noise can be attained using low
ESR type electrolytic and tantalum capacitors.
Maintaining low noise on power supplies and ground is critical
to obtain optimum results from the AD9764. If properly
implemented, ground planes can perform a host of functions on
high speed circuit boards: bypassing, shielding current trans-
port, etc. In mixed signal design, the analog and digital portions
of the board should be distinct from each other, with the analog
ground plane confined to the areas covering the analog signal
traces, and the digital ground plane confined to areas covering
the digital interconnects.
All analog ground pins of the DAC, reference and other analog
components should be tied directly to the analog ground plane.
The two ground planes should be connected by a path 1/8 to
1/4 inch wide underneath or within 1/2 inch of the DAC to
maintain optimum performance. Care should be taken to ensure
that the ground plane is uninterrupted over crucial signal paths.
On the digital side, this includes the digital input lines running
to the DAC as well as any clock signals. On the analog side, this
includes the DAC output signal, reference signal and the supply
feeders.
The use of wide runs or planes in the routing of power lines is
also recommended. This serves the dual role of providing a low
series impedance power supply to the part, as well as providing
some “free” capacitive decoupling to the appropriate ground
plane. It is essential that care be taken in the layout of signal and
power ground interconnects to avoid inducing extraneous volt-
age drops in the signal ground paths. It is recommended that all
connections be short, direct and as physically close to the pack-
age as possible in order to minimize the sharing of conduction
paths between different currents. When runs exceed an inch in
length, strip line techniques with proper termination resistors
should be considered. The necessity and value of this resistor
will be dependent upon the logic family used.
For a more detailed discussion of the implementation and con-
struction of high speed, mixed signal printed circuit boards,
refer to Analog Devices’ application notes AN-280 and AN-333.
TTL/CMOS
Applications
Figure 38. Differential LC Filter for Single +5 V or +3 V
CIRCUITS
LOGIC
POWER SUPPLY
+5V OR +3V
FERRITE
BEADS
100 F
ELECT.
10-22 F
TANT.
AD9764
0.1 F
CER.
AVDD
ACOM