MXR9500MZ MEMSIC, MXR9500MZ Datasheet - Page 7

• Manufacturer Part Number: MXR9500MZ
• Description: IC, 3 AXIS ACCELEROMETER, ± 1.5G, LCC-16
• Manufacturer: MEMSIC

Specifications of MXR9500MZ

• No. Of Axes: 3
• Sensor Case Style: LCC
• No. Of Pins: 16
• Supply Voltage Range: 2.7V To 3.6V
• Operating Temperature Range: -40°C To +85°C
• Termination Type: SMD
• Acceleration Range: ± 1.5g
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MXR9500G/M PIN DESCRIPTIONS
VDD1, VDD2, VDD3– These pins are the supply input for
the circuits and the sensor heater in the
DC voltage should be between 2.7 and 3.6 volts. Refer to
the section on PCB layout and fabrication suggestions for
guidance on external parts and connections recommended.
VSA1, VSA2– These pins are ground pin for the
accelerometer.
SCK1, SCK2– These pins are for factory used only, should
be connect to ground.
DI1, DI2– These pins are the power down control pin. Pull
these pins HIGH will put the accelerometer into power
down mode. When the part goes into power down mode,
the total current will be smaller than 0.1uA at 3V.
connected to Ground.
Xout – This pin is the analog output of the X-axis
acceleration sensor.
Yout –
acceleration sensor
Zout –
acceleration sensor.
MEMSIC MXR9500G/M Rev.D
In normal operation mode, this pin should be
This pin is the analog output of the Z-axis
This pin is the analog output of the Y-axis
accelerometer
. The
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POWER SUPPLY NOISE REJECTION
One capacitor is recommended for best rejection of power
supply noise. The capacitor should be located as close as
possible to the device supply pin (VDD1,VDD3). The
capacitor lead length should be as short as possible, and
surface mount capacitor is preferred. For typical
applications, the capacitor can be ceramic 0.1 µF.
PCB LAYOUT AND FABRICATION SUGGESTIONS
1. It is best to solder a 0.1uF capacitor directly across
2. Robust low inductance ground wiring should be used.
Power Supply
VDD1, VSA1 and VDD3, VSA2 pin.
VDD1
VDD3
Accelerometer
MEMSIC
2/27/2007