83888 SENSONOR TECHNOLOGIES AS, 83888 Datasheet - Page 4

• Manufacturer Part Number: 83888
• Description: IC, SENSOR, GYRO, SAR150, 28LCC
• Manufacturer: SENSONOR TECHNOLOGIES AS

Specifications of 83888

• Sensor Case Style: LCC
• No. Of Pins: 28
• Supply Voltage Range: 4.45V To 5.5V
• Operating Temperature Range: -40°C To +90°C
• Ic Generic Number: SAR150 - 100
• Interface: SPI
• Interface Type: SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1
1.1
1.2
TS1514 rev. 1
The SAR150 consists of a ButterflyGyro™ MEMS die and a BiCMOS ASIC
housed in a rigid custom ceramic LCC package to accommodate dual axis
surface mounting. The function is based on the excitation of a reference motion in
the butterfly structure. An angular rotation of the device will generate Coriolis
forces, whose frequency equals that of the reference motion and whose resulting
vibration amplitude is a measure for the angular rotation. By utilizing Sensonor
Technologies‟ unique patented sealed cavity technology, the vibrating masses are
contained within the low-pressure hermetic environment needed for creating low
dynamic damping and high Q factors, without any degradation over the lifetime of
the device. The gyro die is built as a triple stack consisting of a bottom glass die
with metalized patterns defining excitation and detection electrodes, a middle
micro machined mono crystalline silicon die with the oscillating masses, which
also represent a common opposite electrode, and a third top cap glass die. A time multiplexed, switched interface is
used between the gyro die and the ASIC. This makes it possible to improve the symmetry by using the same
electrodes for drive interface and sense interface. By the symmetric mechanical design and by connecting the
electrodes cross-wise symmetric, the "butterfly” masses are operating in a balanced anti-phase movement. The
balanced operation of both the excitation mode and the detection mode makes SAR150 almost insensitive to
environmental vibrations, limiting effects causing bias drift as well as improves the Q-factors. A fine-tuning of the
oscillation frequencies, to allow for force-feedback operation, is done during final test for each sensor by applying
and programming an electrostatic bias to reduce the mechanical stiffness and thereby calibrate the detection mode
Figure 1-1: SAR150 Block diagram
Product Description
o Horizontal or vertical mounting
o High reliability and robustness over long
o Low vibration sensitivity
o High overload and shock capability (5000 g)
o Butterfly balanced design for high
o Closed-loop force feedback operation with
o Low bias drift
o Ideal mono crystalline Si material
o Wafer level sealing with controlled Q-factor
Features
Overview
lifetime
mechanical common mode rejection
electrostatic frequency tuning
Driver
Driver
LNA
LNA
DATASHEET
Excitation
Detection
control
control
clock generator
Demodulator
control and
shifter 90°
Power up
Phase
- 4 -
References,
decimation
bias and
OTPROM
ADC and
PTAT
Gain, offset and
compensation
temperature
SPI serial
4th order
interface
LPF
IIR
o Low power
o Single supply +5 VDC
o Fully digital with SPI communication and on
o Digitally controlled sample rate up to 2000
o Bandwidth defined by built in 4th order digital
o Intrinsic continuous diagnostic monitoring
o Temperature sensor
o No external components required
chip OTP calibration
SPS
LP filter
SAR150 GYRO SENSOR
LOAD
SCLK
MOSI
MISO
frequency. Fixed algorithms use
individually determined
calibration coefficients stored in
OTPROM poly fuse cells.
Readings from the internal
temperature sensor are used for
accurate angular rate
definitions. An SPI interface
enables communication
between application and
SAR150. The angular rate data
output is in a 12-bit 2‟s
complement format. A number
of functions are available
through the digital SPI interface.
Figure 1-2 SAR150 Element
structure
SAR150