LM317AMDT National Semiconductor, LM317AMDT Datasheet - Page 5

• Manufacturer Part Number: LM317AMDT
• Description: IC, ADJ LINEAR REG, 1.2V TO 37V, TO252-3
• Manufacturer: National Semiconductor

Specifications of LM317AMDT

• Primary Input Voltage: 40V
• Dropout Voltage Vdo: 2V
• No. Of Outputs: 1
• No. Of Pins: 3
• Output Current: 500mA
• Operating Temperature Range: -40°C To +125°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Reference Voltage
Line Regulation
Load Regulation
Thermal Regulation
Adjustment Pin Current
Adjustment Pin Current Change
Temperature Stability
Minimum Load Current
Current Limit
RMS Output Noise, % of V
Ripple Rejection Ratio
Long-Term Stability
Thermal Resistance, θ
Junction-to-Case
Thermal Resistance, θ
Junction-to-Ambient
(No Heat Sink)
LM317A and LM317 Electrical Characteristics
Specifications with standard type face are for T
ture Range. Unless otherwise specified, V
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The
guaranteed specifications apply only for the test conditions listed.
Note 2: Refer to RETS117H drawing for the LM117H, or the RETS117K for the LM117K military specifications.
Note 3: I
(TO-252), and E (LCC) packages. Device power dissipation (P
thermal resistance (θ
to National’s Average Outgoing Quality Level (AOQL).
Note 4: Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are
covered under the specifications for thermal regulation.
Note 5: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 6: When surface mount packages are used (TO-263, SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by increasing the PC
board copper area that is thermally connected to the package. See the Applications Hints section for heatsink techniques.
MAX
Parameter
= 1.5A for the K (TO-3), T (TO-220), and S (TO-263) packages. I
JA
). The maximum allowable power dissipation at any temperature is : P
JC
JA
OUT
3V ≤ (V
10 mA ≤ I
3V ≤ (V
10 mA ≤ I
20 ms Pulse
10 mA ≤ I
3V ≤ (V
T
(V
(V
(V
10 Hz ≤ f ≤ 10 kHz
V
C
V
C
T
K (TO-3) Package
T (TO-220) Package
S (TO-263) Package
EMP (SOT-223) Package
H (TO-39) Package
MDT (TO-252) Package
K (TO-3) Package
T (TO-220) Package
S (TO-263) Package (Note 6)
EMP (SOT-223) Package (Note 6)
H (TO-39) Package
MDT (TO-252) Package (Note 6)
MIN
J
OUT
OUT
ADJ
ADJ
IN
IN
K, T, S Packages
EMP Package
H, MDT Packages
IN
K, T, S Packages
EMP Package
H, MDT Packages
= 125˚C, 1000 hrs
− V
− V
− V
≤ T
= 0 µF
= 10 µF
= 10V, f = 120 Hz,
= 10V, f = 120 Hz,
IN
IN
IN
OUT
OUT
OUT
J
IN
OUT
OUT
OUT
− V
− V
− V
≤ T
− V
) = 40V
) ≤ 15V
) = 40V
Conditions
OUT
OUT
OUT
MAX
J
≤ I
≤ I
≤ I
OUT
= 25˚C, and those with boldface type apply over full Operating Tempera-
D
) is limited by ambient temperature (T
MAX
MAX
MAX
) ≤ 40V,
) ≤ 40V (Note 4)
) ≤ 40V
= 5V, and I
(Note 4)
MAX
5
OUT
= 1.0A for the EMP (SOT-223) package. I
= 10 mA.
1.238
1.225
0.112
0.075
Min
D(MAX)
1.0
0.5
66
-
-
(Note 3)
= ((T
LM317A
A
), device maximum junction temperature (T
1.250
1.250
0.005
0.003
0.01
0.04
0.30
0.20
23.5
Typ
140
186
103
0.1
0.3
0.2
3.5
1.5
0.8
0.3
50
65
80
21
12
J(MAX)
1
-
-
-
-
-
-
-
-
- T
1.262
1.270
Max
0.01
0.02
0.07
A
100
0.5
2.6
1.8
10
)/θ
1
5
1
-
JA
). All Min. and Max. limits are guaranteed
0.112
0.075
1.20
0.15
Min
MAX
1.5
1.0
0.5
66
-
= 0.5A for the H (TO-39), MDT
LM317
0.003
1.25
1.25
0.01
0.02
0.04
0.40
0.30
0.20
23.5
Typ
140
186
103
0.1
0.3
0.2
3.5
2.2
1.5
0.8
0.3
50
65
80
21
12
39
50
50
1
2
4
4
J
Max
1.30
0.04
0.07
0.07
), and package
100
www.national.com
0.5
1.5
3.4
2.6
1.8
10
5
1
-
Units
˚C/W
˚C/W
%/W
%/V
mA
µA
µA
dB
dB
%
%
%
%
V
V
A
A