LM2937IMP-5.0 National Semiconductor, LM2937IMP-5.0 Datasheet - Page 10

IC, LDO, 5V, 500MA, SOT223

LM2937IMP-5.0

Manufacturer Part Number
LM2937IMP-5.0
Description
IC, LDO, 5V, 500MA, SOT223
Manufacturer
National Semiconductor
Datasheet

Specifications of LM2937IMP-5.0

Primary Input Voltage
26V
Output Voltage
5V
Dropout Voltage Vdo
500mV
No. Of Pins
3
Output Current
500mA
Voltage Regulator Case Style
SOT-223
Operating Temperature Range
-40°C To +85°C
Svhc
No SVHC
Output Voltage Fixed
5V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Application Hints
When a value for θ
a heatsink must be selected that has a value that is less than
or equal to this number.
θ
in the catalog, or shown in a curve that plots temperature rise
vs power dissipation for the heatsink.
HEATSINKING TO-263 AND SOT-223 PACKAGE PARTS
Both the TO-263 (“S”) and SOT-223 (“MP”) packages use a
copper plane on the PCB and the PCB itself as a heatsink.
To optimize the heat sinking ability of the plane and PCB,
solder the tab of the package to the plane.
Figure 3 shows for the TO-263 the measured values of θ
for different copper area sizes using a typical PCB with 1
ounce copper and no solder mask over the copper area used
for heatsinking.
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. It should also
be observed that the minimum value of θ
package mounted to a PCB is 32˚C/W.
As a design aid, Figure 4 shows the maximum allowable
power dissipation compared to ambient temperature for the
TO-263 device (assuming θ
mum junction temperature is 125˚C).
(H−A)
FIGURE 3. θ
is specified numerically by the heatsink manufacturer
(J−A)
(H−A)
vs. Copper (1 ounce) Area for the
TO-263 Package
is found using the equation shown,
(J−A)
(Continued)
is 35˚C/W and the maxi-
(J−A)
01128028
for the TO-263
(J−A)
10
Figure 5 and Figure 6 show the information for the SOT-223
package. Figure 6 assumes a θ
copper and 51˚C/W for 2 ounce copper and a maximum
junction temperature of +85˚C.
FIGURE 4. Maximum Power Dissipation vs. T
FIGURE 5. θ
(J−A)
the TO-263 Package
SOT-223 Package
vs Copper (2 ounce) Area for the
(J−A)
of 74˚C/W for 1 ounce
01128030
01128029
AMB
for

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