PIC32MX440F128L-80I/BG Microchip Technology, PIC32MX440F128L-80I/BG Datasheet - Page 204

IC, 32BIT MCU, PIC32, 80MHZ, BGA-100

PIC32MX440F128L-80I/BG

Manufacturer Part Number
PIC32MX440F128L-80I/BG
Description
IC, 32BIT MCU, PIC32, 80MHZ, BGA-100
Manufacturer
Microchip Technology
Series
PIC® 32MXr

Specifications of PIC32MX440F128L-80I/BG

Controller Family/series
PIC32
Ram Memory Size
32KB
Cpu Speed
80MHz
No. Of Timers
5
Interface
EUSART, I2C, SPI, USB
No. Of Pwm Channels
5
Core Size
32 Bit
Program Memory Size
128 KB
Core Processor
MIPS32® M4K™
Speed
80MHz
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
121-TFBGA
Embedded Interface Type
EUSART, I2C, SPI, USB
Rohs Compliant
Yes
Processor Series
PIC32MX4xx
Core
MIPS
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
EUART, I2C, SPI
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
85
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM320003, DM320002, MA320002
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1000 - PIC32 BREAKOUT BOARD
Number Of I /o
-
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC32MX440F128L-80I/BG
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC32MX3XX/4XX
TABLE A-2:
DS61143G-page 204
Section 29.0 “Electrical
Characteristics”
Section 30.0 “Packaging Information” Added the 121-pin XBGA package marking information and package
“Product Identification System”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Updated the Absolute Maximum Ratings and added Note 3.
Added Thermal Packaging Characteristics for the 121-pin XBGA package
(see Table 29-3).
Updated the conditions for parameters DC20, DC21, DC22 and DC23 in
Table 29-5.
Updated the comments for parameter D321 (C
Updated the SPIx Module Slave Mode (CKE = 1) Timing Characteristics,
changing SP52 to SP35 between the MSb and Bit 14 on SDOx (see
Figure 29-13).
details.
Added the definition for BG (121-lead 10x10x1.1 mm, XBGA).
Added the definition for Speed.
Update Description
© 2010 Microchip Technology Inc.
EFC
) in Table 29-14.

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