S29GL01GP13FFIV10 Spansion Inc., S29GL01GP13FFIV10 Datasheet - Page 20
![IC, FLASH, 1000MBIT, 130NS, TSOP-64](/photos/19/5/190515/4386991_sml.jpg)
S29GL01GP13FFIV10
Manufacturer Part Number
S29GL01GP13FFIV10
Description
IC, FLASH, 1000MBIT, 130NS, TSOP-64
Manufacturer
Spansion Inc.
Datasheet
1.S29GL01GP13FFIV10.pdf
(80 pages)
Specifications of S29GL01GP13FFIV10
Memory Type
Flash
Memory Size
1000Mbit
Memory Configuration
128K X 16
Ic Interface Type
Parallel
Access Time
130ns
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
TSOP
No. Of Pins
64
Cell Type
NOR
Density
1Gb
Access Time (max)
130ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
27/26Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
Fortified BGA
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
128M/64M
Supply Current
110mA
Mounting
Surface Mount
Pin Count
64
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
7.2
7.3
7.4
7.5
20
Word/Byte Configuration
VersatileIO
Read
Page Read Mode
The BYTE# pin controls whether the device data I/O pins operate in the byte or word configuration. If the
BYTE# pin is set at logic ‘1’, the device is in word configuration, DQ0-DQ15 are active and controlled by CE#
and OE#.
If the BYTE# pin is set at logic ‘0’, the device is in byte configuration, and only data I/O pins DQ0-DQ7 are
active and controlled by CE# and OE#. The data I/O pins DQ8-DQ14 are tri-stated, and the DQ15 pin is used
as an input for the LSB (A-1) address function.
The VersatileIO
tolerates on all inputs and outputs (address, control, and DQ signals). V
Information on page 9
For example, a V
and from other 1.8 or 3 V devices on the same data bus.
All memories require access time to output array data. In a read operation, data is read from one memory
location at a time. Addresses are presented to the device in random order, and the propagation delay through
the device causes the data on its outputs to arrive with the address on its inputs.
The device defaults to reading array data after device power-up or hardware reset. To read data from the
memory array, the system must first assert a valid address on Amax-A0, while driving OE# and CE# to V
WE# must remain at V
DQ0 after address access time (t
The OE# signal must be driven to V
elapsed from the falling edge of OE#, assuming the t
The device is capable of fast page mode read and is compatible with the page mode Mask ROM read
operation. This mode provides faster read access speed for random locations within a page. The page size of
the device is 8 words/16 bytes. The appropriate page is selected by the higher address bits A(max)-A3.
Address bits A2-A0 in word mode (A2 to A-1 in byte mode) determine the specific word within a page. The
microprocessor supplies the specific word location.
The random or initial page access is equal to t
locations specified by the microprocessor falls within that page) is equivalent to t
asserted and reasserted for a subsequent access, the access time is t
are obtained by keeping the “read-page addresses” constant and changing the “intra-read page” addresses.
TM
(V
TM
IO
IO
(V
) Control
of 1.65-3.6 volts allows for I/O at the 1.8 or 3 volt levels, driving and receiving signals to
IO
) control allows the host system to set the voltage levels that the device generates and
IH
for V
. All addresses are latched on the falling edge of CE#. Data will appear on DQ15-
IO
S29GL-P MirrorBit
options on this device.
ACC
IL
), which is equal to the delay from stable addresses to valid output data.
. Data is output on DQ15-DQ0 pins after the access time (t
D a t a
ACC
®
Flash Family
or t
ACC
CE
S h e e t
and subsequent page read accesses (as long as the
access time has been meet.
ACC
IO
S29GL-P_00_A13 November 17, 2010
range is 1.65 to V
or t
CE
PACC
. Fast page mode accesses
. When CE# is de-
CC
. See
OE
) has
Ordering
IL
.