S29GL256P11FFI010 Spansion Inc., S29GL256P11FFI010 Datasheet - Page 7

• Manufacturer Part Number: S29GL256P11FFI010
• Description: IC, FLASH, 256MBIT, 110NS, BGA-64
• Manufacturer: Spansion Inc.

Specifications of S29GL256P11FFI010

• Memory Type: Flash
• Memory Size: 256Mbit
• Memory Configuration: 128K X 16
• Ic Interface Type: Parallel
• Access Time: 110ns
• Supply Voltage Range: 2.7V To 3.6V
• Memory Case Style: BGA
• No. Of Pins: 64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1.
1.1
November 21, 2006 S29GL-P_00_A3
Ordering Information
Recommended Combinations
The ordering part number is formed by a valid combination of the following:
Notes
1. Type 0 is standard. Specify other options as required.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading “S29” and packing type designator from ordering part number.
4. Contact local sales representative for availability, and on the following part numbers: S29GL01GP12TFI010, S29GL01GP12FFI010,
Recommended Combinations list configurations planned to be supported in volume for this device. Consult
your local sales office to confirm availability of specific recommended combinations and to check on newly
released combinations.
S29GL01GP
S29GL512P
S29GL256P
S29GL128P
S29GL01GP13TFIV10, S29GL01GP13FFIV10.
D a t a
S29GL01GP
S29GL512P,
S29GL256P,
S29GL128P
1 Gb
DEVICE NUMBER/DESCRIPTION
S29GL01GP, S29GL512P, S29GL256P, S29GL128P
3.0 Volt-only, 1024, 512, 256 and 128 Megabit (32 M x 16-Bit/64 M x 8-Bit) Page-Mode Flash Memory
Manufactured on 90 nm MirrorBit
S h e e t
10
F
Speed (ns)
11
12
13
11
12
13
( A d v a n c e
S29GL-P Valid Combinations
A
S29GL-P MirrorBit
I
Temperature
01
Package &
FAI , FFI
(Note 4)
(Note 4)
TAI , TFI
TM
process technology
0
I n f o r m a t i o n )
PACKING TYPE
0 = Tray (standard; see
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER (V
01 = V
02 = V
V1 = V
V2 = V
R1 = V
R2 = V
TEMPERATURE RANGE
I
PACKAGE MATERIALS SET
A = Pb
F = Pb-free
PACKAGE TYPE
T = Thin Small Outline Package (TSOP) Standard Pinout
F = Fortified Ball Grid Array, 1.0 mm pitch package
SPEED OPTION
11 = 110 ns
12 = 120 ns
13 = 130 ns
TM
= Industrial (–40°C to +85°C)
Flash Family
Model Number
V1
V1
01
01
IO
IO
IO
IO
IO
IO
(Note 4)
= V
= V
= 1.65 to V
= 1.65 to V
= V
= V
(Note
(Note
(Note
(Note
R1, R2
R1, R2
CC
CC
CC
CC
4), 02
4), V2
4), 02
4), V2
= 2.7 to 3.6 V, highest address sector protected
= 2.7 to 3.6 V, lowest address sector protected
= 3.0 to 3.6 V, highest address sector protected
= 3.0 to 3.6 V, lowest address sector protected
(Note 4)
CC
CC
IO
, V
, V
range, protection when WP# =V
0, 2, 3
(Note 1)
CC
CC
0, 3
Pack Type
= 2.7 to 3.6 V, highest address sector protected
= 2.7 to 3.6 V, lowest address sector protected
(Note 1)
(Note 1)
LAA064 (Fortified BGA)
TS056 (TSOP)
Package Description
IL
)
(Note 2)
(Note 3)
5