74LVC1G126GW NXP Semiconductors, 74LVC1G126GW Datasheet - Page 2

• Manufacturer Part Number: 74LVC1G126GW
• Description: IC, LOGIC, 74LVC1G, BUFFER, UMT5
• Manufacturer: NXP Semiconductors

Specifications of 74LVC1G126GW

• Supply Voltage Range: 1.65V To 5.5V
• Logic Case Style: SOT-353
• No. Of Pins: 5
• Operating Temperature Range: -40°C To +125°C
• Svhc: No SVHC (18-Jun-2010)
• Logic Ic Base: RoHS Compliant
• Package / Case: SOT-353
• Logic Device Type: Buffer / Line Driver, Non Inverting
• Rohs Compliant: Yes

NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74LVC1G126
Product data sheet
Type number
74LVC1G126GW
74LVC1G126GV
74LVC1G126GM
74LVC1G126GF
74LVC1G126GN
Type number
74LVC1G126GW
74LVC1G126GV
74LVC1G126GM
74LVC1G126GF
74LVC1G126GN
74LVC1G126GS
74LVC1G126GS
Fig 1.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
2
1
Logic symbol
Ordering information
Marking codes
A
OE
mna125
Package
Temperature range
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
Y
4
All information provided in this document is subject to legal disclaimers.
Fig 2.
Rev. 10 — 29 December 2010
Name
TSSOP5
SC-74A
XSON6
XSON6
XSON6
XSON6
2
1
IEC logic symbol
OE
Marking
VN
V26
VN
VN
VN
VN
mna126
plastic extremely thin small outline package;
plastic extremely thin small outline package;
extremely thin small outline package; no leads;
Description
plastic thin shrink small outline package;
5 leads; body width 1.25 mm
plastic surface-mounted package; 5 leads
no leads; 6 terminals; body 1  1.45  0.5 mm
no leads; 6 terminals; body 1  1  0.5 mm
6 terminals; body 0.9  1.0  0.35 mm
extremely thin small outline package; no leads;
6 terminals; body 1.0  1.0  0.35 mm
[1]
4
Fig 3.
OE
A
Bus buffer/line driver; 3-state
Logic diagram
74LVC1G126
© NXP B.V. 2010. All rights reserved.
Version
SOT353-1
SOT753
SOT886
SOT891
SOT1115
SOT1202
mna127
2 of 19
Y