DSPIC30F2010-30I/SPG Microchip Technology, DSPIC30F2010-30I/SPG Datasheet - Page 230

• Manufacturer Part Number: DSPIC30F2010-30I/SPG
• Description: 16BIT 30MIPS DSPIC, 30F2010, DIP28
• Manufacturer: Microchip Technology
• Series: DsPIC30Fr

Specifications of DSPIC30F2010-30I/SPG

• Core Frequency: 30MHz
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 12KB
• Supply Voltage Range: 2.5V To 5.5V
• Operating Temperature Range: -40°C To
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

dsPIC30F
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70082E-page 228
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-085
B
c
*Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
β
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
(F)
p
E
D
B
α
n
A
φ
c
β
L
L
n
Advance Information
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
0
5
5
D1
φ
CH x 45°
INCHES
D
NOM
.024
.394
.394
.020
.043
.039
.006
.039
.472
.472
.007
.009
.035
A1
3.5
16
64
10
10
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.041
.011
.045
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0.64
5
5
0
MILLIMETERS*
 2004 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
0.50
1.10
1.00
0.15
0.60
1.00
0.18
0.22
0.89
3.5
64
16
10
10
A2
MAX
α
12.25
12.25
10.10
10.10
1.20
1.05
0.25
0.75
0.23
0.27
1.14
15
15
7