LM5101CMA National Semiconductor, LM5101CMA Datasheet - Page 4

• Manufacturer Part Number: LM5101CMA
• Description: DRIVER, HALF BRIDGE, 100V 1A, SMD
• Manufacturer: National Semiconductor

Specifications of LM5101CMA

• Device Type: MOSFET
• Module Configuration: High Side / Low Side
• Peak Output Current: 1A
• Input Delay: 26ns
• Output Delay: 22ns
• Supply Voltage Range: 9V To 14V
• Driver Case Style: SOIC
• No. Of Pins: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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SOIC-8
Pin Descriptions
Note: For LLP-8, LLP-10 and eMSOP-8 package, it is recommended that the exposed pad on the bottom of the package is soldered to ground plane
on the PC board, and that ground plane should extend out from beneath the IC to help dissipate heat. For LLP-10 package, pins 5 and 6 have no
connection.
1
2
3
4
5
6
7
8
PSOP-8
EP
1
2
3
4
5
6
7
8
LLP-8
EP
1
2
3
4
5
6
7
8
Pin #
LLP-10
EP
10
1
2
3
4
7
8
9
eMSOP-8
EP
1
2
3
4
5
6
7
8
EP (LLP and PSOP and eMSOP
packages)
Name
VDD
VSS
HO
HB
HS
LO
HI
LI
4
Positive gate drive
supply
High-side gate driver
bootstrap rail
High-side gate driver
output
High-side MOSFET
source connection
High-side driver
control input
Low-side driver
control input
Ground return
Low-side gate driver
output
Description
Locally decouple to VSS using low
ESR/ESL capacitor located as close
to the IC as possible.
Connect the positive terminal of the
bootstrap capacitor to HB and the
negative terminal to HS. The
bootstrap capacitor should be placed
as close to the IC as possible.
Connect to the gate of high-side
MOSFET with a short, low
inductance path.
Connect to the bootstrap capacitor
negative terminal and the source of
the high-side MOSFET.
The LM5100A/B/C inputs have
CMOS type thresholds. The
LM5101A/B/C inputs have TTL type
thresholds. Unused inputs should be
tied to ground and not left open.
The LM5100A/B/C inputs have
CMOS type thresholds. The
LM5101A/B/C inputs have TTL type
thresholds. Unused inputs should be
tied to ground and not left open.
All signals are referenced to this
ground.
Connect to the gate of the low-side
MOSFET with a short, low
inductance path.
Solder to the ground plane under the
IC to aid in heat dissipation.
Application Information