CAT4004VP2-T3 CATALYST SEMICONDUCTOR, CAT4004VP2-T3 Datasheet - Page 7

• Manufacturer Part Number: CAT4004VP2-T3
• Description: IC, LED DRIVER, CONSTANT CURRENT, TDFN-8
• Manufacturer: CATALYST SEMICONDUCTOR

Specifications of CAT4004VP2-T3

• Led Driver Application: LCD Display Backlight, Digital Still Cameras
• No. Of Outputs: 4
• Output Current: 40mA
• Output Voltage: 3.3V
• Input Voltage: 2.4V To 5.5V
• Topology: Constant Current
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Pin Function
VIN is the supply pin for the device logic. A small 1 mF
ceramic bypass capacitor is required between the VIN pin
and ground near the device. The operating input voltage
range is from 2.5 V to 5.5 V. Whenever the input supply falls
below the under−voltage threshold (1.8 V), all the LED
channels are disabled and the device enters shutdown mode.
EN/DIM is the enable and one wire dimming input for all
LED channels. Levels of logic high and logic low are set at
1.3 V and 0.4 V respectively. When EN/DIM is initially
taken high, the device becomes enabled and all LED
currents are set to the full scale according to the resistor
R
mode, the EN/DIM pin must be held low for at least 1.5 ms.
LED1 to LED4 provide the internal regulated current for
each of the LED cathodes. There pins enter a high
Table 5. PIN DESCRIPTIONS
SET
Pin #
TAB
1
2
3
4
5
6
7
8
. To place the device into “zero current” shutdown
EN/DIM
Name
RSET
LED1
LED2
LED3
LED4
GND
TAB
VIN
Device enable (active high) and dimming control
Ground reference
LED1 cathode terminal
LED2 cathode terminal
LED3 cathode terminal
LED4 cathode terminal
RSET external LED mirror gain 128
Device supply input, connect to battery or supply
Connect to GND on the PCB
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impedance zero current state whenver the device is placed
in shutdown mode.
RSET is connected to the resistor (R
current for the LEDs. The voltage at this pin is regulated to
0.6 V. The ground side of the external resistor should be star
connected back to the GND of the PCB. In shutdown mode,
RSET beomes high impedance.
GND is the ground reference for the device. The pin must be
connected to the ground plane on the PCB.
TAB is the exposed pad underneath the package. For best
thermal performance, the tab should be soldered to the PCB
and connected to the ground plane.
Function
SET
) to set the full scale