AD5522JSVDZ Analog Devices Inc, AD5522JSVDZ Datasheet
![IC, DAC, 16BIT, QFP-80](/photos/7/64/76487/ad5522jsvdz_sml.jpg)
AD5522JSVDZ
Manufacturer Part Number
AD5522JSVDZ
Description
IC, DAC, 16BIT, QFP-80
Manufacturer
Analog Devices Inc
Datasheet
1.AD5522JSVDZ.pdf
(64 pages)
Specifications of AD5522JSVDZ
Resolution (bits)
16bit
Input Channel Type
Serial
Supply Voltage Range - Digital
2.3V To 5.25V
Supply Current
36mA
Digital Ic Case Style
QFP
No. Of Pins
80
Data Interface
LVDS, Serial
Design Resources
Parametric Measurement Unit and Supporting Components for PAD Appls Using AD5522 and AD7685 (CN0104)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AD5522JSVDZ
Manufacturer:
WD
Quantity:
1 000
Company:
Part Number:
AD5522JSVDZ
Manufacturer:
Analog Devices Inc
Quantity:
10 000
Part Number:
AD5522JSVDZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
1
PCN
PCN #: 08_0085
Title:
AD5522 Device iteration to improve FI ac crosstalk
Date Published:
September 19, 2008
Type:
Device
Part Number:
AD5522
Proposed Change:
From: Wafer Fabrication Manufacturing part number YJ40B (S4 silicon)
To: Wafer Fabrication Manufacturing part number YJ40C (S5 silicon)
Metal iteration on AD5522 die.
Wafer fabrication process, die size and data sheet specifications remain unchanged.
In addition to this iteration the following unrelated data sheet changes have been made.
Datasheet specification changes unrelated to design change
- Measure Current Common-Mode Error from +/-0.01% to +/-0.005% (gain = 5)
- Timing SPI T16 correction to units from ns to us (micro)
- LVDS Timing
- change to specs to target 100MHz SCLK frequency (DVCC = 4.5V to 5.25V).
- Leakage current of CPOH1/SDOb and SDO changes from +/-1uA to +/-2uA.
Addition of new specs unrelated to design change
- Combined leakage at DUT (25degC to 70degC) +/-15nA.
Reason for Change:
The purpose of this metal iteration is to improve FI ac crosstalk (Fig. 25 on AD5522 datasheet Rev.0). There is no further change in
the function and performance of the AD5522.
Summary of Supporting Information:
Qualification results are contained in the attached report
Material shipped with an assembly date-code of 0831, or with an assembly date-code of 0839 onwards, will have S5 silicon.
Planned Date Change Effective:
October 1, 2008
EIA Date Code:
0840
Contact:
Helen Stapleton
Related parts for AD5522JSVDZ
AD5522JSVDZ Summary of contents
Page 1
PCN #: 08_0085 Title: AD5522 Device iteration to improve FI ac crosstalk Date Published: September 19, 2008 Type: Device Part Number: AD5522 Proposed Change: From: Wafer Fabrication Manufacturing part number YJ40B (S4 silicon) To: Wafer Fabrication Manufacturing part number ...
Page 2
Marketing Engineer Phone: +353 61 495421 Email: helen.stapleton@analog.com Analog Devices, Inc. -- ADI Confidential -- ...