LTC4160EUDC#PBF Linear Technology, LTC4160EUDC#PBF Datasheet - Page 27

IC, BATT CHRG, Li-Ion, Li-Polymer, 1.2A, QFN20

LTC4160EUDC#PBF

Manufacturer Part Number
LTC4160EUDC#PBF
Description
IC, BATT CHRG, Li-Ion, Li-Polymer, 1.2A, QFN20
Manufacturer
Linear Technology
Datasheet

Specifications of LTC4160EUDC#PBF

Battery Type
Li-Ion, Li-Polymer
Input Voltage
5.5V
Battery Charge Voltage
4.2V
Charge Current Max
1.2A
Battery Ic Case Style
QFN
No. Of Pins
20
No. Of Series Cells
1
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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LT
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Quantity:
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APPLICATIONS INFORMATION
Figure 11. Higher Frequency Ground Current Follow Their
Incident Path. Slices in the Ground Plane Create Large Loop
Areas. The Large Loop Areas Increase the Inductance of the Path
Leading to Higher System Noise.
The IDGATE pin for the external ideal diode controller has
extremely limited drive current. Care must be taken to
minimize leakage to adjacent PC board traces. 100nA of
leakage from this pin will introduce an additional offset to
the ideal diode of approximately 10mV. To minimize leakage,
the trace can be guarded on the PC board by surrounding
it with V
less than one volt higher than IDGATE.
OUT
connected metal, which should generally be
TRANSCEIVER
ON-THE-GO
LTC4160-1
B DEVICE
LTC4160/
ENOTG
Figure 10. LTC4160/LTC4160-1 as the B Device
OVSENS
OVGATE
V
41601 F11
BUS
C
<6.5µF
WITHOUT OVP
B
(OPTIONAL)
>96µF FOR STANDARD HOST
OVP
<6.5µF FOR OTG DEVICES
D
D
+
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC4160/LTC4160-1:
1. The Exposed Pad of the package (Pin 21) should connect
2. The trace connecting V
3. Connections between the PowerPath switching regulator
4. The switching power trace connecting SW to its respec-
directly to a large ground plane to minimize thermal and
electrical impedance.
capacitor should be as short as possible. The GND
side of these capacitors should connect directly to the
ground plane of the part. These capacitors provide the
AC current to the internal power MOSFETs and their
drivers. It is critical to minimize inductance from these
capacitors to the LTC4160/LTC4160-1.
inductor and the output capacitor on V
as short as possible. Use area fills whenever possible.
The GND side of the output capacitors should connect
directly to the thermal ground plane of the part.
tive inductor should be minimized to reduce radiated
EMI and parasitic coupling.
C
A
LTC4160/LTC4160-1
STANDARD OR
USB HOST OR
TRANSCEIVER
ON-THE-GO
ON-THE-GO
STANDARD
MANAGER
A DEVICE
POWER
BUS
to its respective decoupling
41601 F12
OUT
should be kept
27
41601fa

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