ADA4858-3ACPZ-R2 Analog Devices Inc, ADA4858-3ACPZ-R2 Datasheet - Page 5

• Manufacturer Part Number: ADA4858-3ACPZ-R2
• Description: IC, OP-AMP, 600MHZ, 600V/µs, LFCSP-16
• Manufacturer: Analog Devices Inc

Specifications of ADA4858-3ACPZ-R2

• Op Amp Type: High Speed
• No. Of Amplifiers: 3
• Bandwidth: 600MHz
• Slew Rate: 600V/µs
• Supply Voltage Range: 3V To 5.5V
• Amplifier Case Style: LFCSP
• No. Of Pins: 16
• Amplifier Type: Current Feedback
• Number Of Circuits: 3
• -3db Bandwidth: 600MHz
• Current - Input Bias: 8µA
• Voltage - Input Offset: 500µV
• Current - Supply: 19mA
• Current - Output / Channel: 21mA
• Voltage - Supply, Single/dual (±): 3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 16-LFCSP
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• Gain Bandwidth Product: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Internal Power Dissipation
Input Voltage (Common Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Lead Temperature
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Specification is for device in free air.
16-Lead LFCSP
(Soldering, 10 sec)
1
Rating
6 V
See Figure 2
(−V
±V
Observe power derating curves
−65°C to +125°C
−40°C to +105°C
300°C
S
S
− 0.2 V) to (+V
S
− 1.2 V)
Rev. A | Page 5 of 20
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
ADA4858-3 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for
plastic encapsulated devices is determined by the glass transition
temperature of the plastic, approximately 150°C. Temporarily
exceeding this limit may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure.
To ensure proper operation, it is necessary to observe the
maximum power derating curves in Figure 2.
ESD CAUTION
Figure 2. Maximum Power Dissipation vs. Ambient Temperature
2.5
2.0
1.5
1.0
0.5
0
–40
–20
AMBIENT TEMPERATURE (°C)
0
20
40
60
ADA4858-3
80
100