MMA6280Q Freescale Semiconductor, MMA6280Q Datasheet - Page 7
![SENSOR ACCEL XZ-AX +/-1.5G 16QFN](/photos/38/65/386548/qfn-16_sml.jpg)
MMA6280Q
Manufacturer Part Number
MMA6280Q
Description
SENSOR ACCEL XZ-AX +/-1.5G 16QFN
Manufacturer
Freescale Semiconductor
Datasheet
1.MMA6280Q.pdf
(13 pages)
Specifications of MMA6280Q
Axis
X, Z
Acceleration Range
±1.5g, 2g, 4g, 6g (Config)
Sensitivity
800mV/g, 600mV/g, 300mV/g, 200mV/g
Voltage - Supply
2.2 V ~ 3.6 V
Output Type
Analog
Bandwidth
350Hz - X, 150Hz - Z
Mounting Type
Surface Mount
Package / Case
16-QFN
Sensing Axis
X, Z
Acceleration
1.5 g, 2 g, 4 g, 6 g
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.2 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 20 C
For Use With
RD3152MMA7260Q - BOARD REF 3-AXIS ACCELEROMETER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Interface
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MMA6280QR2
Manufacturer:
FREESCALE
Quantity:
1 000
Company:
Part Number:
MMA6280QT
Manufacturer:
PANASONIC
Quantity:
2 300
7
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
ground. It is not recommended for the flag to be soldered
down.
MMA6280QT
Surface mount board layout is a critical portion of the total
With the correct footprint, the packages will self-align when
The flag underneath the package is internally connected to
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Pin 1 ID
(non-metallic)
Note: The die pad (flag) is not generally recommended to be
soldered down for consumer product application. All dimensions
are in mm.
Figure 7. PCB Footprint for 16-Lead QFN, 6x6 mm for
Consumer Grade Products and Applications
Freescale Semiconductor
Do not solder down
flag and 4 corner
ground pads on the
package for
consumer application
Do not place any top
metal patterns or via
structures beneath
the package
Sensors