MMA6280Q Freescale Semiconductor, MMA6280Q Datasheet - Page 7

• Manufacturer Part Number: MMA6280Q
• Description: SENSOR ACCEL XZ-AX +/-1.5G 16QFN
• Manufacturer: Freescale Semiconductor

Specifications of MMA6280Q

• Axis: X, Z
• Acceleration Range: ±1.5g, 2g, 4g, 6g (Config)
• Sensitivity: 800mV/g, 600mV/g, 300mV/g, 200mV/g
• Voltage - Supply: 2.2 V ~ 3.6 V
• Output Type: Analog
• Bandwidth: 350Hz - X, 150Hz - Z
• Mounting Type: Surface Mount
• Package / Case: 16-QFN
• Sensing Axis: X, Z
• Acceleration: 1.5 g, 2 g, 4 g, 6 g
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.2 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 20 C
• For Use With: RD3152MMA7260Q - BOARD REF 3-AXIS ACCELEROMETER
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Interface: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

7
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
ground. It is not recommended for the flag to be soldered
down.
MMA6280QT
Surface mount board layout is a critical portion of the total
With the correct footprint, the packages will self-align when
The flag underneath the package is internally connected to
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Pin 1 ID
(non-metallic)
Note: The die pad (flag) is not generally recommended to be
soldered down for consumer product application. All dimensions
are in mm.
Figure 7. PCB Footprint for 16-Lead QFN, 6x6 mm for
Consumer Grade Products and Applications
Freescale Semiconductor
Do not solder down
flag and 4 corner
ground pads on the
package for
consumer application
Do not place any top
metal patterns or via
structures beneath
the package
Sensors