ADXL345BCCZ Analog Devices Inc, ADXL345BCCZ Datasheet - Page 3

• Manufacturer Part Number: ADXL345BCCZ
• Description: IC ACCEL SPI/I2C 3AX 3G 14LGA
• Manufacturer: Analog Devices Inc
• Series: iMEMS®r

Specifications of ADXL345BCCZ

• Acceleration Range: ±2g, 4g, 8g, 16g
• Design Resources: Sensing Low-g Acceleration Using ADXL345 Digital Accelerometer Connected to ADuC7024 (CN0133)
• Axis: X, Y, Z
• Sensitivity: 256LSB/g, 128LSB/g, 64LSB/g, 32LSB/g
• Voltage - Supply: 2 V ~ 3.6 V
• Output Type: Digital
• Bandwidth: 6.25Hz ~ 3.2kHz Selectable
• Interface: I²C, SPI
• Mounting Type: Surface Mount
• Package / Case: 14-LGA
• No. Of Axes: 3
• Sensor Case Style: LGA
• No. Of Pins: 14
• Supply Voltage Range: 2V To 3.6V
• Operating Temperature Range: -40°C To +85°C
• Package: 14LGA
• Acceleration: ±2/±4/±8/±16 g
• Axis Type: Triple
• Operating Supply Voltage: 2 to 3.6 V
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: EVAL-ADXL345Z - BOARD EVALUATION FOR ADXL345EVAL-ADXL345Z-S - BOARD SATELLITE FOR ADXL345Z-MEVAL-ADXL345Z-M - BOARD EVAL FOR ADXL345
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: Q4372599

REVISION HISTORY
11/10—Rev. A to Rev. B
Change to 0 g Offset vs. Temperature for Z-Axis Parameter,
Table 1 .................................................................................................4
Changes to Figure 10 to Figure 15 ..................................................9
Changes to Ordering Guide...........................................................37
4/10—Rev. 0 to Rev. A
Changes to Features Section and General
Description Section...........................................................................1
Changes to Specifications Section...................................................3
Changes to Table 2 and Table 3 .......................................................5
Added Package Information Section, Figure 2, and Table 4;
Renumbered Sequentially ................................................................5
Changes to Pin 12 Description, Table 5 .........................................6
Added Typical Performance Characteristics Section ...................7
Changes to Theory of Operation Section and Power Sequencing
Section ..............................................................................................12
Changes to Powers Savings Section, Table 7, Table 8, Auto Sleep
Mode Section, and Standby Mode Section ..................................13
Changes to SPI Section...................................................................14
Changes to Figure 36 to Figure 38 ................................................15
Changes to Table 9 and Table 10 ...................................................16
Changes to I
Changes to Table 12 ........................................................................18
Changes to Interrupts Section, Activity Section, Inactivity
Section, and FREE_FALL Section.................................................19
Added Table 13 ................................................................................19
Changes to FIFO Section ...............................................................20
2
C Section and Table 11 ............................................17
Rev. B | Page 3 of 40
Changes to Self-Test Section and Table 15 to Table 18 ..............21
Added Figures 42 and Table 14 .....................................................21
Changes to Table 19 ........................................................................22
Changes to Register 0x1D—THRESH_TAP (Read/Write)
Section, Register 0x1E, Register 0x1F, Register 0x20—OFSX,
OFSY, OSXZ (Read/Write) Section, Register 0x21—DUR
(Read/Write) Section, Register 0x22—Latent (Read/Write)
Section, and Register 0x23—Window (Read/Write) Section ...23
Changes to ACT_X Enable Bits and INACT_X Enable Bit
Section, Register 0x28—THRESH_FF (Read/Write) Section,
Register 0x29—TIME_FF (Read/Write) Section, Asleep Bit
Section, and AUTO_SLEEP Bit Section.......................................24
Changes to Sleep Bit Section .........................................................25
Changes to Power Supply Decoupling Section, Mechanical
Considerations for Mounting Section, and Tap Detection
Section ..............................................................................................27
Changes to Threshold Section.......................................................28
Changes to Sleep Mode vs. Low Power Mode Section...............29
Added Offset Calibration Section.................................................29
Changes to Using Self-Test Section ..............................................30
Added Data Formatting of Upper Data Rates Section, Figure 48,
and Figure 49 ...................................................................................31
Added Noise Performance Section, Figure 50 to Figure 52, and
Operation at Voltages Other Than 2.5 V Section .......................32
Added Offset Performance at Lowest Data Rates Section and
Figure 53 to Figure 55.....................................................................33
6/09—Revision 0: Initial Version
ADXL345