MMA6281QT Freescale Semiconductor, MMA6281QT Datasheet - Page 7

• Manufacturer Part Number: MMA6281QT
• Description: IC ACCELEROMETER XZ AXIS 16-QFN
• Manufacturer: Freescale Semiconductor

Specifications of MMA6281QT

• Axis: X, Z
• Acceleration Range: ±2.5g, 3.3g, 6.7g, 10g (Config)
• Sensitivity: 480mV/g, 360mV/g, 180mV/g, 120mV/g
• Voltage - Supply: 2.2 V ~ 3.6 V
• Output Type: Analog
• Bandwidth: 350Hz - X, 150Hz - Z
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Sensing Axis: X, Z
• Acceleration: 2.5 g, 3.3 g, 6.7 g, 10 g
• Supply Voltage (max): 3.3 V
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• For Use With: RD3152MMA7260Q - BOARD REF 3-AXIS ACCELEROMETER
• Interface: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Sensors
Freescale Semiconductor
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
ground. It is not recommended for the flag to be soldered
down.
Surface mount board layout is a critical portion of the total
With the correct footprint, the packages will self-align when
The flag underneath the package is internally connected to
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Pin 1 ID
(non-metallic)
Note: The die pad (flag) is not generally recommended to be
soldered down for consumer product application. All dimensions
are in mm.
Figure 7. PCB Footprint for 16-Lead QFN, 6x6 mm for
Consumer Grade Products and Applications
Do not solder down
flag and 4 corner
ground pads on the
package for
consumer application
Do not place any top
metal patterns or via
structures beneath
the package
MMA6281QT
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