MMA2301EGR2 Freescale Semiconductor, MMA2301EGR2 Datasheet - Page 10

• Manufacturer Part Number: MMA2301EGR2
• Description: IC SENSOR ACCEL +/-200G 16-SOIC
• Manufacturer: Freescale Semiconductor
• Series: MMAr

Specifications of MMA2301EGR2

• Axis: X or Y
• Acceleration Range: ±225g
• Sensitivity: 10mV/g
• Voltage - Supply: 4.75 V ~ 5.25 V
• Output Type: Analog
• Bandwidth: 400Hz
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.300", 7.50mm Width)
• Sensing Axis: X
• Acceleration: 200 g
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• No. Of Axes: 1
• Sensor Case Style: SOIC
• No. Of Pins: 16
• Supply Voltage Range: 4.75V To 5.25V
• Operating Temperature Range: -40°C To +125°C
• Acceleration Range ±: 200gf
• Rohs Compliant: Yes
• Package Type: SOIC
• Operating Supply Voltage (min): 4.75V
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.25V
• Operating Temperature (min): -40C
• Operating Temperature (max): 125C
• Operating Temperature Classification: Automotive
• Product Height (mm): 3.3mm
• Mounting: Surface Mount
• Pin Count: 16
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS Compliant
• Interface: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PRODUCT NUMBERING SYSTEM FOR PRESSURE SENSORS
1
2
Examples:
Actual product marking may be abbreviated due to space constraints but packaging label will reflect full part number.
Only applies to qualified and prototype products. This does not apply to custom products.
MPX10DP
MPXA4115A6T1
10 kPa uncompensated, differential device in minibody package, ported, no leadform, shipped in trays.
115 kPa automotive temperature compensated and calibrated device with signal conditioning, SOP surface mount with gull wing leadform, shipped in tape and reel.
M
S
P, X PROTOTYPE DEVICE
QUALIFIED STANDARD
CUSTOM DEVICE
CATEGORY
NONE UNCOMPENSATED
2
3
4
5
6
7
8
TEMPERATURE COMPENSATED/
OPEN
TEMPERATURE COMPENSATED/
AUTOMOTIVE ACCURACY
TEMPERATURE COMPENSATED/
HIGH TEMPERATURE
POSITIVE/NEGATIVE PRESSURE
CMOS
CALIBRATED
CALIBRATED/SIGNAL CONDITIONED
CALIBRATED/SIGNAL CONDITIONED
FEATURES
NONE UNIBODY, CHIP PAK
A/V
AZ/VZ SMALL OUTLINE MEDIA
C
H
HZ
M
Y
2
PRESSURE SENSORS
SMALL OUTLINE PACKAGE
CHIP PAK
SUPER SMALL OUTLINE
SUPER SMALL OUTLINE
M-PAK
SUPER SMALL OUTLINE
(SOP)
RESISTANT PACKAGE
PACKAGE (SSOP)
MEDIA RESISTANT PACKAGE
PACKAGE (TPM)
PACKAGE TYPE
M PX A 2 XXX A P X T1
RATED PRESSURE IN kPa
EXCEPT FOR MPX2300
EXPRESSED IN mm Hg.
1
NONE NO LEADFORM
0
1—2
3—5
6—7
(6 = GULL WING/SURFACE MOUNT)
(7 = 87 DEGREES/DIP)
LEADFORM OPTIONS
TYPE OF DEVICE
A
G
D
V
OPEN
(CONSULT FACTORY)
OPEN
SOP ONLY
C
P
S
SX
W
ABSOLUTE
GAUGE
DIFFERENTIAL
VACUUM/GAUGE
AXIAL PORT (SMALL OUTLINE PACKAGE)
PORTED
SINGLE PORT (AP, GP, GVP)
DUAL PORT (DP)
STOVEPIPE PORT (UNIBODY)
AXIAL PORT (UNIBODY)
ROBUST AXIAL PORT
PORTING STYLE
NONE TRAYS
T1
U
SHIPPING METHOD
TAPE AND REEL
1 INDICATES PART
ORIENTATION IN
TAPE
RAIL
SG1010Q42009
SG1010–10