PHP02512E2001BBT5 Vishay, PHP02512E2001BBT5 Datasheet - Page 2
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PHP02512E2001BBT5
Manufacturer Part Number
PHP02512E2001BBT5
Description
RES 2.0K OHM 2.5W .1% 2512
Manufacturer
Vishay
Series
PHPr
Datasheet
1.PHP02512E10R0BST5.pdf
(4 pages)
Specifications of PHP02512E2001BBT5
Resistance (ohms)
2K
Number Of Terminations
2
Package / Case
2512 (6432 Metric)
Power (watts)
2.5W
Composition
Thin Film
Features
Flame Proof
Temperature Coefficient
±25ppm/°C
Tolerance
±0.1%
Size / Dimension
0.259" L x 0.124" W (6.58mm x 3.15mm)
Height
0.033" (0.84mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
PHP
Vishay Thin Film
Notes
• Chip surface temperature measured using FLIR A40 thermal
• Thermal imaging was conducted under ambient conditions
• Thermal imaging and load life testing was conducted mounting
www.vishay.com
80
DIMENSIONS in inches
CASE SIZE
1206
2512
LAND PATTERN DIMENSIONS in inches
STANDARD MATERIAL SPECIFICATIONS
Resistive Element
Substrate Material
Terminations (Tin/Lead)
Terminations (Lead (Pb)-free)
PHP CHIP TEMP. VS. APPLIED POWER
imaging system with an approximate test card surface
temperature of 85 °C.
resulting in a steady state test card surface temperature of 85 °C
over the full range of power levels.
one device to 2" x 3" test cards with 2.5 mil copper plating on
both surfaces. Thermal vias on 120 mil centers were utilized for
heat transfer between surfaces of the test card.
5.00
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
0.259 + 0.009/- 0.015
1206 - 100 Ω
1206 - 5 kΩ
1206 - 10 kΩ
Chip Surface Temperature (°C)
70
0.126 ± 0.008
PHP Land Pattern for 1206 Case Size
LENGTH
0.0710
150
High Power Thin Film Wraparound Chip Resistor
0.0755
0.0220
For technical questions, contact:
200
W (± 0.005)
T
WIDTH
0.063
0.124
Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier
L
E
THICKNESS
0.015/0.033
0.015/0.033
Notes
• Chip surface temperature measured using FLIR A40 thermal
MIN./MAX.
Tin/lead solder over nickel barrier
PHP CHIP TEMP. VS. APPLIED POWER
thinfilm@vishay.com
imaging system with an approximate test card surface
temperature of 85 °C.
0.1260
Temperature
PHP Land Pattern for 2512 Case Size
Resistance
W
Case Size
D
Value
150
200
70
Alumina (Al
10.00
9.00
8.00
7.00
6.00
5.00
4.00
3.00
2.00
1.00
0.00
Nichrome
0.0910
0.020 + 0.005/- 0.010
2
Up to 10
2512 - 10 Ω
2512 - 10 kΩ
2512 - 30 kΩ
Chip Surface Temperature (°C)
O
70
3
0.1090
D (± 0.005)
2512
2.44
6.82
9.33
TOP PAD
)
0.02
150
Up to 10 k
Power (W)
Document Number: 60076
2512
1.81
4.89
6.63
Revision: 24-Feb-11
BOTTOM PAD
E (± 0.005)
200
0.040
0.050
Up to 30 k
2512
1.87
5.19
7.09