OARSXPR010FLF TT Electronics/IRC, OARSXPR010FLF Datasheet - Page 2

• Manufacturer Part Number: OARSXPR010FLF
• Description: RES .010 OHM 5W 1% FLAT SMD
• Manufacturer: TT Electronics/IRC
• Series: OARS XPr

Specifications of OARSXPR010FLF

• Resistance (ohms): 0.01
• Number Of Terminations: 2
• Package / Case: Non-Standard SMD
• Power (watts): 5W
• Composition: Metal Element
• Features: Current Sense, Flame Proof
• Temperature Coefficient: ±40ppm/°C
• Tolerance: ±1%
• Size / Dimension: 0.470" L x 0.250" W (11.94mm x 6.35mm)
• Height: 0.180" (4.57mm)
• Material, Element: Metal Element
• Package Type: 2524
• Power, Rating: 3 W
• Resistance: 0.01 Ohms
• Special Features: Current Sense
• Termination: SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 989-1018-2

Physical Data
Wire and Film Technologies Division
Telephone: [phone] • Facsimile: 361 992 3377 • Website: www.irctt.com
Power Derating Curve
OARS XP
Open Air Sense Resistors
Metal Alloy Strip
6.0
5.0
4.0
3.0
2.0
0.0
OARS-XP
25
OARS XP R0025 Thermal Image @ 5 Watts
Type
IRC
Ambient conditions, No forced air.
60
Ambient Temperature (°C)
95
L (Resistance
0.425 - 0.470
Dependant)
(10.7 - 12.0)
130
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
T
165
D
L
H (Resistance
195
0.090 - 0.180
Dependant)
(2.28 - 4.57)
Dimensions (Inches and (mm))
225
W
Note:
The power derating curve is a guidance based on a conser-
vative design model. The OARS XP is a solid metal alloy
construction that can withstand signifi cantly greater operating
temperatures than conservative design models permit. The
resistive alloys can withstand temperatures in exess of 350°C.
Therefore, the system thermal design is a more signifi cant
design parameter due to the heat limitations of solder joints
and/or circuit board substrate materials. Refer to additional
information below.
The thermal image (not a simulation) to the left is of an OARS
XP 2.5 mΩ running at 5 Watts. Notice the hotpsot is nearly
205°C, but the solder joint is approximately 115°C (FR4 is
rated for 130°C). The unique construction of the OARS XP
isolates the hotspot from the circuit board material preventing
damage. Additionally, the thermal energy is dissipated to the
air instead of being conducted into the circuit board potentially
causing a nearby power component to exceed its rating.
The standard test circuit board consists of a four layer FR4
material with 2 ounce outer layers and 1 ounce inner layers,
which is typical of many industry designs. Contact IRC for
more details or for other thermal image test data for specifi c
resistance values and power levels.
0.093 ± 0.010
(2.36 ± 4.57)
T
0.190 ± 0.030
(4.83 ± 0.76)
D
H
OARS-XP Issue March 2010 Sheet 2 of 3
0.250 ± 0.015
(6.35 ± 0.38)
W