OARS3R010FLF TT Electronics/IRC, OARS3R010FLF Datasheet - Page 2

• Manufacturer Part Number: OARS3R010FLF
• Description: RES .010 OHM 3W 1% FLAT SMD
• Manufacturer: TT Electronics/IRC
• Series: OARS-3r

Specifications of OARS3R010FLF

• Resistance (ohms): 0.01
• Number Of Terminations: 2
• Package / Case: Non-Standard SMD
• Power (watts): 3W
• Composition: Metal Element
• Features: Current Sense, Flame Proof
• Temperature Coefficient: ±40ppm/°C
• Tolerance: ±1%
• Size / Dimension: 0.440" L x 0.125" W (11.18mm x 3.18mm)
• Height: 0.120" (3.05mm)
• Material, Element: Metal Element
• Package Type: 2512
• Power, Rating: 3 W
• Resistance: 0.01 Ohms
• Special Features: Current Sense
• Termination: SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 989-1013-2; OARS-3-R010FLF

Wire and Film Technologies Division
Telephone: [phone] • Facsimile: 361 992 3377 • Website: www.irctt.com
Power Derating Curve
OARS-3
Open Air Sense Resistors
Metal Alloy Strip
Environmental Data
Test Spec: AEC Q200
TCR +125 to -55°C
Thermal Shock
High Temperature Exposure 125°C
Temperature Cycling: -40 to +125°C
Operational Life
Baised Humidity
Mechanical Shock
Vibration
Moisture Resistance
Terminal Strength
Solvent Resistance
Solderability
3.5
3.0
2.5
2.0
1.0
0.0
25
OARS R005 Thermal Image @ 4 Watts
Ambient conditions, No forced air.
60
Ambient Temperature (°C)
95
130
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
165
195
225
2m - 3m
240ppm
<0.75%
<1.75%
<0.75%
<1.0%
<2.0%
<1.5%
<1.0%
<1.0
Note:
The power derating curve is a guidance based on a con-
servative design model. The OARS is a solid metal alloy
construction that can withstand signifi cantly greater operating
temperatures than conservative design models permit. The
resistive alloys can withstand temperatures in exess of 350°C.
Therefore, the system thermal design is a more signifi cant
design parameter due to the heat limitations of solder joints
and/or circuit board substrate materials. Refer to additional
information below.
The thermal image (not a simulation) to the left is of an OARS
5 mΩ running at 4 Watts, which exceeds the 1 Watt conserva-
tive model. Notice the hotpsot is nearly 230°C, but the solder
joint is approximately 110°C (FR4 is rated for 130°C). The
unique construction of the OARS isolates the hotspot from
the circuit board material preventing damage. Additionally,
the thermal energy is dissipated to the air instead of being
conducted into the circuit board potentially causing a nearby
power component to exceed its rating.
The standard test circuit board consists of a four layer FR4
material with 2 ounce outer layers and 1 ounce inner layers,
which is typical of many industry designs. Contact IRC for
more details or for other thermal image test data for specifi c
resistance values and power levels.
Meets MIL-STD-202 Method 215
Meets J-STD-002 Method B
Meets JIS-C-6429
4m - 15m
<0.75%
40ppm
<0.5%
<1.0%
<1.0%
<0.5%
<1.0%
<1.0%
<2.5%
February 2009 Issue Page 2 of 4