HSF-1-100-2700-K-LF TT Electronics/IRC, HSF-1-100-2700-K-LF Datasheet - Page 3

• Manufacturer Part Number: HSF-1-100-2700-K-LF
• Description: RES HIGH SURGE 270 OHM 1W 2512
• Manufacturer: TT Electronics/IRC
• Series: HSFr

Specifications of HSF-1-100-2700-K-LF

• Resistance (ohms): 270
• Number Of Terminations: 2
• Package / Case: 2512 (6432 Metric)
• Power (watts): 1W
• Composition: Thick Film
• Temperature Coefficient: ±100ppm/°C
• Tolerance: ±10%
• Size / Dimension: 0.122" Dia x 0.250" L (3.10mm x 6.35mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Height: -
• Other names: 989-1191-2

Wire and Film Technologies Division
Telephone: [phone] • Facsimile: 361 992 3377 • Website: www.irctt.com
HSF
High Surge Film
Surface Mount Metal Glaze
* Tolerance: The device manufacturer/supplier shall assure process compat-
ibility up to and including the stated classifi cation temperature at the rated MSL
level.
Average Ramp-up rate (T smax to T p )
Preheat
- Temperature Min (T smin )
- Temperature Max (T smax )
- Time (T smin to T smax ) (ts)
Time maintained above
- Temperature (T L )
- Time (t L )
Peak Temperature (T P )
Time within 5°C of actual Peak Temperature (tp) 2
Ramp-down Rate
Time 25°C to Peak Temperature
1.6 mm - 2.5 mm
Thickness
Thickness
< 1.6 mm
≥ 2.5 mm
< 2.5 mm
≥ 2.5 mm
Package
Package
Package Peak Refl ow Temperatures
Package Peak Refl ow Temperatures
Tabel 1: SnPb Eutectic Process -
Profi le Feature
Tabel 2: Pb-free Process -
Volume mm 3
Volume mm 3 < 350
260°C *
260°C *
250°C *
< 350
240 +0/-5°C
225 +0/-5°C
* Based on Industry Standards and IPC recommendations
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
IRC Solder Refl ow Recommendations
T
T
25
P
L
T
T
Volume mm 3
smax
smin
350 - 2000
260°C *
250°C *
245°C *
Volume mm 3 ≥ 350
Sn-Pb Eutectic and Pb-Free Reflow Profiles
225 +0/-5°C
225 +0/-5°C
Preheat
t 25°C to Peak
3°C / second max.
6°C / second max.
Volume mm 3
Sn-Pb Eutectic
60 - 150 seconds
60 -120 seconds
t
10 - 30 seconds
6 minutes max.
s
260°C *
245°C *
245°C *
TM
> 2000
Assembly
See Table 1
100°C
150°C
183°C
Time
Ramp-up
3°C / second max.
6°C / second max.
60 - 150 seconds
60 -180 seconds
20 - 40 seconds
8 minutes max.
Assembly
See Table 2
Note 1: Package volume excludes external
terminals (balls, bumps, lands, leads) and/or
non-integral heat sinks.
Note 2: The maximum component temperature
reached during refl ow depends on package
thickness and volume. The use of convection
refl ow processess reduces the thermal gradients
between packages. However, thermal gradients
due to differences in thermal mass of SMD pack-
ages may still exist.
Note 3: Components intended for use in “lead-
free” assembly process shall be evaluated using
the “lead-free” peak temperature and profi les
defi ned in Table 1, 2 and refl ow profi le whether
or not lead-free.
Pb-Free
150°C
200°C
217°C
t
t
P
L
Ramp-down
Critical Zone
T
Note 1: All temperatures refer
to topside of the package,
measured on the package
body surface.
Note 2: Time within 5 °C of
actual peak temperature (tp)
specifi ed for the refl ow profi les
is a “supplier” minimum and a
“user” maximum.
L
to T
P
HSF-1 Series Issue October 2010 Sheet 3 of 4