STM32W108B-SK STMicroelectronics, STM32W108B-SK Datasheet - Page 6

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STM32W108B-SK

Manufacturer Part Number
STM32W108B-SK
Description
STARTER KIT FOR STM32W108
Manufacturer
STMicroelectronics
Series
STM32r
Type
MCUr

Specifications of STM32W108B-SK

Featured Product
STM32 Cortex-M3 Companion Products
Contents
Board
Silicon Manufacturer
ST Micro
Core Architecture
ARM
Core Sub-architecture
Cortex - M3
Silicon Core Number
STM32
Silicon Family Name
STM32W108xx
Kit Contents
Board
Features
IEEE
Mfg Application Notes
STM32W108 Adjacent Channel Rejection Measurements
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
*
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Part Number:
STM32W108B-SK
Manufacturer:
ST
0
Reference design
6/14
To minimize network loss, the matching topology should try to keep Smith chart loci towards
the center of the Smith chart. To do that, the following impedance transformation options are
available:
PCB parasitic elements play a part in the impedance transformation and even with the
tightest of layouts, traces between the matching elements will add significant reactance at
2.4 GHz. In particular, there will be some series inductance between the package pins and
the first matching element. This is significant when that element is shunted because it
cannot be absorbed into that reactance. Since this effect cannot be avoided, it is best to take
advantage of it.
The option with the lowest loss and least complex arrangement is series inductance
followed by shunt inductance. To make use of the PCB traces, it must be recognized that
they operate more like transmission lines which travel slightly differently on the Smith chart
compared with real inductors and this affects the shunt inductance value.
Traces of 100Ω which equate to 150um wide on a 0.4mm thick FR-4 substrate should be
used. In ST's simple single-ended representation in the Smith chart, the balanced pair must
be modeled as a single 200Ω transmission line.
transformation.
Series inductance followed by Shunt capacitance
Series inductance followed by Shunt inductance
Shunt inductance followed by series capacitance
Shunt inductance followed by Series inductance
This option favors lower balun ratios.
It leads to comparatively large inductance values.
It requires either long PCB traces or two discrete inductors (balanced network)
which means inductor Q becomes an issue.
Similar to auto-transformer action.
Sweet-spot for 100Ω balun if series inductance fabricated from PCB traces since
neither too long nor too short.
Not allowed because DC feed to PA is required from balun centre-tap.
Favors lower balun ratios, but even at 1:1 the required series inductance is
comparatively large.
It requires either long PCB traces or two discrete inductors (balanced network)
which means inductor Q becomes an issue.
Doc ID 17406 Rev 3
Figure 3
illustrates the impedance
AN3206

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