NCP1529ASNT1GEVB ON Semiconductor, NCP1529ASNT1GEVB Datasheet - Page 15

• Manufacturer Part Number: NCP1529ASNT1GEVB
• Description: BOARD EVAL NCP1529
• Manufacturer: ON Semiconductor

Specifications of NCP1529ASNT1GEVB

• Design Resources: NCP1529ASNT1GEVB Schematic NCP1529ASNT1GEVB Gerber Files NCP1529ASNT1GEVB Bill of Materials
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
C A B
1.0
0.037
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
J
CASE 483−02
K
ISSUE G
TSOP−5
0.074
DETAIL Z
1.9
15
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
M
A
B
C
D
G
H
K
S
J
L
inches
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_