LM2842XMK-ADJEV/NOPB National Semiconductor, LM2842XMK-ADJEV/NOPB Datasheet - Page 5

EVAL BOARD FOR LM2842XMK-ADJ

LM2842XMK-ADJEV/NOPB

Manufacturer Part Number
LM2842XMK-ADJEV/NOPB
Description
EVAL BOARD FOR LM2842XMK-ADJ
Manufacturer
National Semiconductor

Specifications of LM2842XMK-ADJEV/NOPB

Silicon Manufacturer
National
Silicon Core Number
LM2842
Kit Application Type
Power Management - Voltage Regulator
Application Sub Type
Buck Regulator
Kit Contents
Board
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended
to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, T
θ
θ
shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
Note 3: Human Body Model, applicable std. JESD22-A114-C.
Note 4: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100%
production tested. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used
to calculate Average Outgoing Quality Level (AOQL).
Note 5: Typical numbers are at 25°C and represent the most likely norm.
Note 6: Includes the bond wires, R
Note 7: Current limit at 0% duty cycle.
Note 8: Bias currents flow into pin.
Note 9: All numbers apply for packages soldered directly onto a 3" x 3" PC board with 2 oz. copper on 4 layers in still air in accordance to JEDEC standards.
Thermal resistance varies greatly with layout, copper thickness, number of layers in PCB, power distribution, number of thermal vias, board size, ambient
temperature, and air flow.
JA
JA
, and the ambient temperature, T
. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal
DSON
A
. The maximum allowable power dissipation at any ambient temperature is calculated using: P
from V
IN
pin to SW pin.
5
J
=175°C (typ.) and disengages at T
J
(MAX), the junction-to-ambient thermal resistance,
D
J
(MAX) = (T
=155°C (typ).
J(MAX)
www.national.com
− T
A
)/

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