TL19W01-N(T32 Toshiba, TL19W01-N(T32 Datasheet - Page 6

• Manufacturer Part Number: TL19W01-N(T32
• Description: LED WHITE DIFF 120LM 5000K SMD
• Manufacturer: Toshiba

Specifications of TL19W01-N(T32

• Featured Product: High Luminous Flux White LEDs - TL19W01 Series
• Lumens @ Current - Max: 132lm
• Lumens/watt @ Current - Test: 121lm/W
• Color: White, Cool
• Current - Test: 300mA
• Luminous Flux @ Current - Test: 120lm
• Current - Max: 350mA
• Voltage - Forward (vf) Typ: 3.3V
• Wavelength: 5000K
• Lens Style/size: Rectangle with Flat Top
• Viewing Angle: 140°
• Mounting Type: Surface Mount
• Package / Case: 2-PLCC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TL19W01-N(T32TR

Packaging
This LED device is packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture
absorption. The optical characteristics of the device may be affected by exposure to moisture in the air before
soldering and the device should therefore be stored under the following conditions:
Mounting Method
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1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
2. After opening the moisture proof bag, the device should be assembled within 168 hours in an environment of
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
Soldering
Reflow soldering (example)
The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions. Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
When any soldering corrections are made manually,a hot-plate should be used and do not use soldering iron.
(only once at each soldering point)
Do not perform wave soldering.
Land pattern dimensions for reference only
Temperature: 5°C~30°C
Humidity: 90% (max)
5°C to 30°C/60% RH or below.
pink) or the expiration date has passed, the device should be baked in taping with reel.
After baking, use the baked device within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 24 to 48 hours.
Expiration date: 12 months from sealing date, which is imprinted on the label affixed.
throw or drop the packed devices.
Temperature profile for Pb soldering (example)
4°C/s max
(*)
240°C max
140~160°C
60~120 s
Time (s)
(*)
max
max
(*)
10 s max
4°C/s max
(*)
(*)
(*)
6
Temperature profile for Pb-free soldering (example)
4°C/s max
150~180°C
Unit : mm
max
260°C max
(*)
4°C/s max
(*)
60~120 s
230°C
Time (s)
(*)
(*)
max
30~50s max
5 s max
(*)
TL19W01-N(T32
(*)
(*)
2010-12-13