STW8Q2PA-S5-CA Seoul Semiconductor Inc, STW8Q2PA-S5-CA Datasheet - Page 21

• Manufacturer Part Number: STW8Q2PA-S5-CA
• Description: LED COOL WHITE 5000K 100MA SMD
• Manufacturer: Seoul Semiconductor Inc

Specifications of STW8Q2PA-S5-CA

• Viewing Angle: 120°
• Package / Case: 4-SMD, Flat Leads
• Lumens @ Current - Max: 45lm
• Lumens/watt @ Current - Test: 94lm/W
• Color: White, Cool
• Current - Test: 100mA
• Luminous Flux @ Current - Test: 30lm
• Current - Max: 160mA
• Voltage - Forward (vf) Typ: 3.2V
• Wavelength: 5000K
• Lens Style/size: Rectangle with Flat Top
• Mounting Type: Surface Mount
• Illumination Color: White
• Wavelength/color Temperature: 5300 K
• Luminous Flux: 30 lm
• Luminous Intensity: 10000 mcd
• Power Rating: 592 mW
• Operating Voltage: 3.2 V
• Operating Current: 100 mA
• Minimum Operating Temperature: - 40 C
• Maximum Operating Temperature: + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 897-1060-2

3) When populating boards in SMT production, there are basically no restrictions regarding the form of the
pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area.
4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions
must be considered during the handling of such devices. Compared to standard encapsulants, silicone is
generally softer, and the surface is more likely to attract dust.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution
must be applied to the surface after the
soldering of components.
5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
6) Please do not mold this product into another resin (epoxy, urethane, etc) and
do not handle this product with acid or sulfur material in sealed space.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
13. Handling of Silicone Resin LEDs
Document No. : SSC-QP-7-07-24
www.seoulsemicon.com
www.seoulsemicon.com
October 2010
October 2010
Rev. 05
Rev. 05