ADP2303ARDZ-5.0-R7 Analog Devices Inc, ADP2303ARDZ-5.0-R7 Datasheet - Page 5

• Manufacturer Part Number: ADP2303ARDZ-5.0-R7
• Description: IC REG SW STPDWN NONSYNCH 8SOIC
• Manufacturer: Analog Devices Inc
• Type: Step-Down (Buck), PFM/PWM - Current Moder

Specifications of ADP2303ARDZ-5.0-R7

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 5V
• Current - Output: 3A
• Frequency - Switching: 700kHz
• Voltage - Input: 3 V ~ 20 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
• Primary Input Voltage: 12V
• No. Of Outputs: 1
• Output Voltage: 5V
• Output Current: 3A
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +125°C
• Msl: MSL 3 - 168 Hours
• Peak Reflow Compatible (260 C): Yes
• Dropout Voltage Vdo: 85mV
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADP2303ARDZ-5.0-R7; ADP2303ARDZ-5.0-R7TR

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Table 4. Pin Function Descriptions
Pin No.
1
2
3
4
5
6
7
8
9 (EPAD)
Mnemonic
BST
VIN
EN
PGOOD
FB
NC
GND
SW
Exposed Pad
Description
Bootstrap Supply for the High-Side MOSFET Driver. A 0.1 μF capacitor is connected between SW and BST to
provide a floating driver voltage for the power switch.
Power Input. Connect to the input power source with a ceramic bypass capacitor to GND directly from this
pin.
Output Enable. Pull this pin high to enable the output. Pull this pin low to disable the output. This pin can
also be used as a programmable UVLO input. This pin has an internal 1.2 μA pull-down current to GND.
Power-Good Open-Drain Output.
Feedback Voltage Sense Input. For the adjustable version, connect this pin to a resistive divider from V
the fixed output version, connect this pin to V
Used for internal testing. Connect to GND or leave this pin floating to ensure proper operation.
Ground. Connect this pin to the ground plane.
Switch Node Output. Connect an inductor to V
The exposed pad should be soldered to an external ground plane underneath the IC for thermal dissipation.
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PAD SHOULD BE SOLDERED
TO AN EXTERNAL GROUND PLANE UNDERNEATH
THE IC FOR THERMAL DISSIPATION.
PGOOD
Figure 3. Pin Configuration (Top View)
BST
VIN
EN
1
2
3
4
Rev. 0 | Page 5 of 28
(Not to Scale)
ADP2302
ADP2303
TOP VIEW
8
7
6
5
OUT
OUT
SW
GND
NC
FB
directly.
and a catch diode to GND from this pin.
ADP2302/ADP2303
OUT
. For