AS1369-BWLT-30 austriamicrosystems, AS1369-BWLT-30 Datasheet - Page 3

• Manufacturer Part Number: AS1369-BWLT-30
• Description: IC REG LDO 200MA 3V 4WLCSP
• Manufacturer: austriamicrosystems

Specifications of AS1369-BWLT-30

• Regulator Topology: Positive Fixed
• Voltage - Output: 3V
• Voltage - Input: Up to 5.5V
• Voltage - Dropout (typical): 0.08V @ 200mA
• Number Of Regulators: 1
• Current - Output: 200mA
• Current - Limit (min): 210mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 4-UFBGA, WLCSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: AS1369-BWLT-30TR

AS1369
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
the device at these or any other conditions beyond those indicated in
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
1. The output PNP structure contains a diode between pins V
2. The maximum allowable power dissipation is a function of the maximum junction temperature (T
Where:
Note:
The AS1369 uses an internal protective structure against light influence. However, exposing the WLP package to direct light could cause device
malfunction.
www.austriamicrosystems.com/LDOs/AS1369
Electrical Parameters
Electrostatic Discharge
Continuous Power Dissipation
Temperature Ranges and Storage Conditions
V
resistance (Θ
lated as:
IN
and V
The value of Θ
down.
Storage Temperature Range
Exceeding the maximum allowable dissipation will cause excessive device temperature and the regulator will go into thermal shut-
Package Body Temperature
Moisture Sensitive Level
Shutdown Input Voltage
OUT
Input/Output Voltage
Junction Temperature
Input Supply Voltage
Power Dissipation
JA
Output Voltage
will activate this diode.
), and the ambient temperature (T
Parameter
Latch-Up
Humidity
I
ESD
OUT
JA
for the WLP package is 345°C/W.
Table 2
2
1
may cause permanent damage to the device. These are stress ratings only, and functional operation of
P
-100
Min
-0.3
-0.3
-0.3
-0.3
AMB
-55
(MAX)
5
). The maximum allowable power dissipation at any ambient temperature is calcu-
1
= (T
IN
+100
+125
+125
+260
Max
500
360
+7
+7
+7
+7
86
J(MAX)
2
and V
Revision 1.05
Electrical Characteristics on page 4
OUT
- (T
Units
mW
mA
kV
ºC
ºC
ºC
%
V
V
V
V
V
AMB
that is normally reverse-biased. reversing the polarity of pins
))/
Θ
“Moisture/Reflow Sensitivity Classification for Non-Hermetic
The reflow peak soldering temperature (body temperature)
JA
specified is in accordance with IPC/JEDEC J-STD-020
Represents a max. floor life time of unlimited
Solid State Surface Mount Devices”.
Internally limited. Mounted on PCB.
CDM JESD22-C101C methods
Norm: MIL 883 E method 3015
J(MAX
Short-circuit protected
Norm: JEDEC 78
Non-condensing
), the junction-to-ambient thermal
is not implied. Exposure to absolute
Comments
(EQ 1)
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