AS13985F-26-T austriamicrosystems, AS13985F-26-T Datasheet - Page 3

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AS13985F-26-T

Manufacturer Part Number
AS13985F-26-T
Description
IC REG LDO 150MA 2.6V 5WLCSP
Manufacturer
austriamicrosystems
Datasheet

Specifications of AS13985F-26-T

Regulator Topology
Positive Fixed
Voltage - Output
2.6V
Voltage - Input
Up to 5.5V
Voltage - Dropout (typical)
0.045V @ 150mA
Number Of Regulators
1
Current - Output
150mA
Current - Limit (min)
300mA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
5-UFBGA, WLCSP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
AS13985F-26-TTR
AS13985
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
1. The output PNP structure contains a diode between pins V
2. The maximum allowable power dissipation is a function of the maximum junction temperature (T
www.austriamicrosystems.com
ing the polarity of pins V
junction-to-ambient thermal resistance (Θ
power dissipation at any ambient temperature is calculated as:
Shutdown Input Voltage (Survival)
Input Supply Voltage (Operating)
Input/Output Voltage (Survival)
Operating Junction Temperature
Input Supply Voltage (Survival)
Storage Temperature Range
Package Body Temperature
Where:
The value of Θ
The value of Θ
Output Voltage (Survival)
Note: Exceeding the maximum allowable dissipation will cause excessive device temperature and the regula-
tor will go into thermal shutdown.
Power Dissipation
I
OUT
Parameter
(Survival)
JA
JA
for the SOT23 package is 220ºC/W in a typical PC-board mounting.
for the WLP package is 225ºC/W.
IN
2
and V
Table 2
OUT
1
will activate this diode.
may cause permanent damage to the device. These are stress ratings only,
P
(MAX)
+2.5
Min
-0.3
-0.3
-0.3
-0.3
-40
-65
JA
), and the ambient temperature (T
= (T
+125
+150
+260
Max
+5.5
+7
+7
+7
+7
J(MAX)
Revision 1.13
- (T
Units
ºC
ºC
ºC
V
V
V
V
V
IN
AMB
and V
))/
temperature) specified is in accordance with IPC/
JEDEC J-STD-020D “Moisture/Reflow Sensitivity
Θ
The lead finish for Pb-free leaded packages is
The reflow peak soldering temperature (body
JA
OUT
Classification for Non-Hermetic Solid State
that is normally reverse-biased. revers-
Surface Mount Devices”.
AMB
Short-circuit protected.
matte tin (100% Sn).
Internally limited.
). The maximum allowable
Comments
J(MAX
), the
(EQ 1)
3 - 12

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