AD7817SR-REEL7 Analog Devices Inc, AD7817SR-REEL7 Datasheet - Page 6
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AD7817SR-REEL7
Manufacturer Part Number
AD7817SR-REEL7
Description
IC ADC 10BIT W/TEMP SNSR 16-SOIC
Manufacturer
Analog Devices Inc
Datasheet
1.AD7817ARZ.pdf
(20 pages)
Specifications of AD7817SR-REEL7
Rohs Status
RoHS non-compliant
Function
Temp Monitoring System (Sensor)
Topology
ADC, Multiplexer, Register Bank
Sensor Type
Internal
Sensing Temperature
-40°C ~ 85°C
Output Type
MICROWIRE™, QSPI™, SPI™
Output Alarm
Yes
Output Fan
Yes
Voltage - Supply
2.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.154", 3.90mm Width)
For Use With
EVAL-AD7816/7/8EB - BOARD EVALUATION FOR AD7816/7/8
AD7816/AD7817/AD7818
ABSOLUTE MAXIMUM RATINGS
(
V
V
Analog Input Voltage to AGND
Reference Input Voltage to AGND
Digital Input Voltage to DGND . . . . . . –0.3 V to V
Digital Output Voltage to DGND . . . . . –0.3 V to V
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
TSSOP, Power Dissipation . . . . . . . . . . . . . . . . . . . . 450 mW
16-Lead SOIC Package, Power Dissipation . . . . . . . . 450 mW
8-Lead SOIC Package, Power Dissipation . . . . . . . . . . 450 mW
T
DD
DD
A
V
θ
Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . 260°C
θ
Lead Temperature, Soldering
θ
Lead Temperature, Soldering
JA
JA
JA
= 25°C unless otherwise noted)
IN1
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 120°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 100°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 157°C/W
to V
IN4
. . . . . . . . . . . . . . . . . . . –0.3 V to V
2
1
. . . –0.3 V to V
DD
DD
DD
DD
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
–6–
µSOIC Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
NOTES
1
2
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
If the Reference Input Voltage is likely to exceed V
during power-up) and the reference is capable of supplying 30 mA or more, it is
recommended to use a clamping diode between the REF
diagram below shows how the diode should be connected.
θ
Lead Temperature, Soldering
JA
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
AD7816/AD7817
REF
IN
BAT81
V
DD
DD
by more than 0.3 V (e.g.,
IN
pin and V
DD
REV. C
pin. The