STM32F103ZCT7 STMicroelectronics, STM32F103ZCT7 Datasheet - Page 107
STM32F103ZCT7
Manufacturer Part Number
STM32F103ZCT7
Description
MCU ARM 32BIT 256KB FLSH 144LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F103VCT6.pdf
(123 pages)
Specifications of STM32F103ZCT7
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
112
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 21x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F103ZCT7
Manufacturer:
STMicroelectronics
Quantity:
10 000
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STM32F103xC, STM32F103xD, STM32F103xE
Figure 59. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
1. Drawing is not to scale.
Table 64.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Symbol
ddd
eee
A1
A2
A3
A4
D1
E1
fff
A
D
E
b
e
F
0.8 mm pitch, package outline
LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package data
0.21
0.35
9.85
9.85
Min
C
Seating plane
A2
A4
B
millimeters
A3
M
10.00
10.00
Doc ID 14611 Rev 7
1.07
0.27
8.80
0.40
8.80
0.80
0.60
0.10
0.15
0.08
Typ
Ball A1
e
10.15
10.15
D1
Max
1.70
0.85
0.45
D
Øb
Ø
Ø
(144 balls)
eee M C A B
fff
F
M
0.0083
0.0138
0.3878
0.3878
C
Typ
F
e
E1 E
A
A
Package characteristics
ddd
A1
inches
0.0421
0.0106
0.0157
0.3937
0.3465
0.3937
0.3465
0.0315
0.0236
0.0039
0.0059
0.0031
Min
C
X3_ME
(1)
0.0669
0.0335
0.0177
0.3996
0.3996
Max
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