PIC16LF721-I/SS Microchip Technology, PIC16LF721-I/SS Datasheet - Page 194
![MCU PIC 4K FLASH 20-SSOP](/photos/19/6/190623/4696163_sml.jpg)
PIC16LF721-I/SS
Manufacturer Part Number
PIC16LF721-I/SS
Description
MCU PIC 4K FLASH 20-SSOP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Specifications of PIC16LF721-I/SS
Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
16MHz
Connectivity
I²C, SPI, UART/USART
Number Of I /o
17
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 12x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP (0.200", 5.30mm Width)
Controller Family/series
PIC16LF
No. Of I/o's
18
Ram Memory Size
256Byte
Cpu Speed
16MHz
No. Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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- Download datasheet (3Mb)
PIC16F/LF720/721
23.5
DS41430A-page 194
Standard Operating Conditions (unless otherwise stated)
Operating temperature-40°C T
Param
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1: I
No.
2: T
3: T
P
Thermal Considerations
DD
INTERNAL
A
J
T
Sym.
P
P
JMAX
= Junction Temperature
PD
= Ambient Temperature
DER
is current to run the chip alone without driving any load on the output pins.
JC
I
JA
/
O
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to
Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
Characteristic
A
+125°C
108.1
Typ.
62.4
85.2
28.1
24.2
32.2
150
2.5
40
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
PD = P
P
P
V
P
OH
INTERNAL
I
DER
/
O
))
= (I
= PD
2010 Microchip Technology Inc.
INTERNAL
OL
= I
MAX
Conditions
* V
DD
(T
OL
+ P
x V
J
) + (I
- T
DD
I
/
O
A
(1)
)/
OH
JA
(2)
* (V
DD
-
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