CSPEMI400G ON Semiconductor, CSPEMI400G Datasheet - Page 9

• Manufacturer Part Number: CSPEMI400G
• Description: IC EMI FLTR W/ESD FOR SIM 10CSP
• Manufacturer: ON Semiconductor

Specifications of CSPEMI400G

• Resistance (ohms): 100
• Capacitance: 20pF
• Power (watts): 0.1W, 1/10W
• Package / Case: 10-CSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Tolerance: -

CSPEMI400
Application Information
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Figure 8.
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
Recommended Non-Solder Mask Defined Pad Illustration
N on-Solder M ask D efined Pad
Solder Stencil Opening
Rev. 2 | Page 9 of 11 | www.onsemi.com
Solder Mask Opening
0.240m m D IA.
0.300m m D IA.
0.290m m D IA.
Non-Solder Mask defined pads
OSP (Entek Cu Plus 106A)
0.125mm - 0.150mm
0.290mm Round
0.300mm Round
50/50 by volume
60 seconds
0.240mm
No Clean
VALUE
+50 µ m
+20 µ m
Round
260° C