CM6304 ON Semiconductor, CM6304 Datasheet

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CM6304

Manufacturer Part Number
CM6304
Description
IC EMI FILTER ESD SIM 8-CSP
Manufacturer
ON Semiconductor
Datasheet

Specifications of CM6304

Resistance (ohms)
47, 100
Capacitance
16.7pF
Package / Case
8-CSP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Power (watts)
-
Product Description
The CM6304 is a 3x3, 8-bump EMI filter with ESD protection device for SIM card applications in a 0.4mm pitch
CSP form factor. It is fully compliant with IEC 61000-4-2. The CM6304 is also RoHS II compliant.
Electrical Schematic / Pin Description
Pin Information
©2010 SCILLC. All rights reserved.
May 2010 Rev. 5
PIN
A2
B1
C1
B2
DESCRIPTION
Channel 1 External
Channel 2 External
Channel 3 External
GND
PIN DESCRIPTIONS
EMI Filters with ESD Protection
for SIM Card Applications
PIN
C3
C2
A3
B3
DESCRIPTION
Channel 1 Internal
Channel 2 Internal
Channel 3 Internal
V External
Publication Order Number:
CM6304
CM6304/D

Related parts for CM6304

CM6304 Summary of contents

Page 1

... Product Description The CM6304 is a 3x3, 8-bump EMI filter with ESD protection device for SIM card applications in a 0.4mm pitch CSP form factor fully compliant with IEC 61000-4-2. The CM6304 is also RoHS II compliant. Electrical Schematic / Pin Description Pin Information PIN DESCRIPTION ...

Page 2

... Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Electrical Specifications and Conditions PARAMETERS AND OPERATING CONDITIONS PARAMETER Storage Temperature Range Operating Temperature Range PART NUMBERING INFORMATION Variation Ordering Part Number CSP-SAC105 Rev Page www.onsemi.com CM6304 1 Part Marking CM6304 64 RATING -55 to +150 -40 to +85 UNITS °C °C ...

Page 3

CM6305 ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER R Resistance 1 R Resistance 2 R Resistance 3 C Capacitance on filter channels 1, 2 and 3 Capacitance on clamp channel (pin C2) V Breakdown Voltage (Positive ESD Protection Peak Discharge ...

Page 4

... RF Characteristics Figure 1. Insertion loss, Filter 1 (pins A2,A3) and Filter 3 (pins C1,C3) (Bias=0V, T Figure 2. Insertion loss, Filter 2 (pins B1,B3) (Bias=0V, T Rev Page www.onsemi.com CM6304 =25 C) ° A =25 C) ° A ...

Page 5

... CM6305 Mechanical Specification CSP-8 Mechanical Specifications The CM6304 is supplied bump Chip Scale Package (CSP). PACKAGE DIMENSIONS Custom CSP Package Bumps Millimeters Dim Min Nom Max 1.155 1.200 1.245 0.0455 0.0472 0.0490 A1 1.155 1.200 1.245 0.0455 0.0472 0.0490 A2 0.395 0.400 0.405 0.0155 0.0157 0.0159 B1 0 ...

Page 6

... Diameter Bump Standoff b Solder Bump Diameter after f Bump Reflow Metal Pad Height c Metal Pad Diameter g D2 Finished Thickness D1 Rev Page www.onsemi.com CM6304 (nominal) Material Dimension Silicon 396μm Polyimide 10μm Plated Cu 5.0μm Sputtered Cu 0.4μm Sputtered Ti 0.1μm 240μm 194μ ...

Page 7

... Mechanical Specification (cont’d) CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) CM6304 1.20 X 1.20 X 0.600 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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