AUIRF4104S International Rectifier, AUIRF4104S Datasheet - Page 2

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AUIRF4104S

Manufacturer Part Number
AUIRF4104S
Description
MOSFET N-CH 40V 75A D2PAK
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheets

Specifications of AUIRF4104S

Input Capacitance (ciss) @ Vds
3000pF @ 25V
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
5.5 mOhm @ 75A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
75A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
100nC @ 10V
Power - Max
140W
Mounting Type
Surface Mount
Package / Case
TO-263-3, D²Pak (2 leads + Tab), TO-263AB
Transistor Polarity
N Channel
Drain Source Voltage Vds
40V
On Resistance Rds(on)
4.3mohm
Rds(on) Test Voltage Vgs
10V
Operating Temperature Range
-55°C To +175°C
Transistor Case Style
D2-PAK
Rohs Compliant
Yes
Configuration
Single
Resistance Drain-source Rds (on)
5.5 mOhms
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
120 A
Power Dissipation
140 W
Mounting Style
SMD/SMT
Gate Charge Qg
68 nC
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
V
∆V
R
V
gfs
I
I
Q
Q
Q
t
t
t
t
L
L
C
C
C
C
C
C
I
I
V
t
Q
t
Electrical Characteristics @ T
Source-Drain Ratings and Characteristics
DSS
GSS
d(on)
r
d(off)
f
S
SM
rr
on
D
S
2
(BR)DSS
GS(th)
SD
DS(on)
iss
oss
rss
oss
oss
oss
g
gs
gd
rr
(BR)DSS
eff.
/∆T
J
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
Effective Output Capacitance
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Parameter
Ù
Parameter
J
= 25°C (unless otherwise specified)
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Min. Typ. Max. Units
Min. Typ. Max. Units
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–––
–––
–––
–––
2.0
40
63
0.032
3000
2160
–––
–––
–––
–––
–––
–––
–––
130
660
380
560
850
–––
–––
–––
4.3
4.5
7.5
6.8
68
21
27
16
38
77
23
-200
–––
–––
–––
250
200
100
–––
–––
–––
–––
–––
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–––
470
5.5
4.0
1.3
20
75
35
10
V/°C
mΩ
nC
nH
nC
µA
nA
pF
ns
ns
V
V
V
A
V
V
Reference to 25°C, I
V
V
V
V
V
V
V
I
V
V
V
I
R
V
Between lead,
6mm (0.25in.)
from package
and center of die contact
V
V
ƒ = 1.0MHz
V
V
V
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
T
di/dt = 100A/µs
D
D
J
J
GS
GS
DS
DS
DS
DS
GS
GS
DS
GS
DD
GS
GS
DS
GS
GS
GS
G
= 75A
= 75A
= 25°C, I
= 25°C, I
= 6.8 Ω
= 0V, I
= 10V, I
= V
= 10V, I
= 40V, V
= 40V, V
= 20V
= -20V
= 32V
= 10V
= 20V
= 10V
= 0V
= 25V
= 0V, V
= 0V, V
= 0V, V
GS
, I
e
e
D
Conditions
Conditions
D
S
F
DS
D
D
DS
DS
= 250µA
GS
GS
= 250µA
= 75A, V
= 75A, V
= 75A
= 75A
= 0V to 32V
= 1.0V, ƒ = 1.0MHz
= 32V, ƒ = 1.0MHz
e
= 0V
= 0V, T
www.irf.com
D
e
= 1mA
GS
DD
J
= 125°C
= 20V
= 0V
f
e

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