N7E50-A516 3M, N7E50-A516 Datasheet - Page 11

• Manufacturer Part Number: N7E50-A516
• Description: CF CARD HEADER TYPE I SMD INVERS
• Manufacturer: 3M
• Series: 7E50r

Specifications of N7E50-A516

• Card Type: Compact Flash - Type I
• Number Of Positions: 50
• Connector Type: Connector
• Insertion, Removal Method: Push In, Pull Out
• Mounting Type: Surface Mount, Right Angle
• Features: Board Guide
• Height Above Board: 0.157" (4.00mm)
• Mounting Feature: Normal, Standard - Top
• Contact Finish: Gold
• Contact Finish Thickness: Flash
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ejector Side: -

3M.com/interconnects
Tripolarized Wiremount Sockets,
4-Wall, Tripolarized Headers,
3M
product
.050" x .100"
.050" x .100"
.100" x .100"
.100" x .100"
PCB 2-Row,
PCB 4-Row,
Series 3400
Series 82
Series 81
Series 78
™
wireMount connector SolutionS
• RoHS Compliant
• 20-100 Positions
• Rugged Tri-Polarized
• High Performance
• Metal Cover Latch
• Optional Metal Strain Relief
• Compatible with PVC, TPE and FEP
• RoHS Compliant
• 20-100 Positions
• Straight and Right Angle
• Vertical SMT Option
• High Temperature
• RoHS Compliant
• 10-64 Positions
• Low Profile
• 2.8 or 3.8 mm Tail Options
• RoHS Compliant
• 10-50 Positions
• Low Profile Design
Version Available
Mating System
Hill-n-Dale IDC Interface
Cable Insulations
Version Available
Version Available
FeatureS
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled Polyester
Flammability UL 94V-0
Plating
Underplating: 100 µ" [ 2.54 µm ]
U-Slot: Matte Tin (RoHS compliant)
Wiping Area: 30 µ" [ 0.76 µm ]
Contact
Material: Copper Alloy
Insulation
Material: High Temperature Plastic
Flammability UL 94V-0
Plating
Wiping Area: 30 µ" [ 0.76 µm ]
Underplating: 100 µ" [ 2.54 µm ]
Contact
Material: Beryllium Copper
Insulation
Material: Glass Filled Polyester
Flammability UL 94V-0
Plating
Underplating: 100 µ" [ 2.54 µm ] Nickel
U Slot and Solder Tails: Gold Flash
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled Polyester
Flammability UL 94V-0
Plating
Underplating: 100 µ" [ 2.54 µm ]
U-Slot and Solder Tails: 10 µ"
Nickel
or Tin-Lead
Gold
Gold
Nickel
Nickel, Class 2
[0.25 µm] Gold
or 200 µ" [5.08 µm] Tin Lead
MaterialS
Current Rating: 0.5 A
Temperature Rating: -55°C to +105°C
Current Rating: 0.5 A
Temperature Rating: -55°C to +105°C
Current Rating: 1 A
Temperature Rating: -55°C to +105°C
Current Rating: 1 A
Temperature Rating: -55°C to +120°C
perForMance
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